MPC8313VRAGDC vs MPC8313ZQADDC Comparison
Detailed side-by-side comparison of MPC8313VRAGDC by NXP Semiconductors and MPC8313ZQADDC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8313ZQADDC - PowerQUICC II Pro 266MHz MPU 516-TEPBGA | NXP
MPC8313ZQADDC ✓ ActiveSpecification Comparison
| Parameter | MPC8313VRAGDC | MPC8313ZQADDC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $32.40 | $21.40 |
| Core Architecture | e300c3 (32-bit Power Architecture) | PowerPC e300c3 |
| CPU Frequency | 400 MHz | — |
| Process Technology | 0.09 um CMOS | 0.09 µm CMOS |
| Instruction Set | Power Architecture, 32-bit RISC | — |
| L1 Cache | [DATA_NEEDED: cache size specifics] | — |
| Memory Controller | DDR1/DDR2, 16/32-bit, up to 333 MHz | — |
| Ethernet | Gigabit MAC with SGMII interface | — |
| USB | USB 2.0 High-Speed (480 Mbps) | — |
| PCI | PCI 2.3, 32-bit, up to 66 MHz | — |
| Security Engine | SEC 2.0 (DES, 3DES, AES, PKA) | AES / DES / 3DES |
| Package | 516-TEPBGA (27x27 mm) with exposed pad | — |
| Supply Voltage | 1.0 V / 1.8 V / 2.5 V / 3.3 V | — |
| Operating Temperature | 0 C to 105 C (commercial / extended) | 0 °C to +105 °C |
| Silicon Revision | Rev 3 | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL Level | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Terminal Count | 516 (BGA) | — |
| Manufacturer | — | NXP Semiconductors / Freescale |
| Series | — | MPC83xx PowerQUICC II Pro |
| Core Count | — | 1 |
| Data Bus Width | — | 32-bit |
| Max Core Frequency | — | 267 MHz |
| Operating Voltage (Core) | — | 1.8 V |
| Operating Voltage (DDR I/O) | — | 2.5 V / 1.8 V |
| Operating Voltage (Standard I/O) | — | 3.3 V |
| Package Type | — | 516-TEPBGA (27x27 mm) |
| Ball Count | — | 516 |
| Integrated Memory Controller | — | DDR1/DDR2 up to 266 MHz |
| Integrated Ethernet | — | 10/100/1000 Mbps (3x eTSEC) |
| USB Interface | — | USB 2.0 High-Speed (Host/Device) |
| PCI Interface | — | PCI 32-bit/66 MHz + mini-PCI |