MPC8313VRAGDC vs MPC8313ZQADDC 比較
詳細並排比較 MPC8313VRAGDC 由 NXP Semiconductors 與 MPC8313ZQADDC 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MPC8313ZQADDC - PowerQUICC II Pro 266MHz MPU 516-TEPBGA | NXP
MPC8313ZQADDC ✓ 啟用中規格比較
| 參數 | MPC8313VRAGDC | MPC8313ZQADDC |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Core Architecture | e300c3 (32-bit Power Architecture) | PowerPC e300c3 |
| CPU Frequency | 400 MHz | — |
| Process Technology | 0.09 um CMOS | 0.09 µm CMOS |
| Instruction Set | Power Architecture, 32-bit RISC | — |
| L1 Cache | [DATA_NEEDED: cache size specifics] | — |
| Memory Controller | DDR1/DDR2, 16/32-bit, up to 333 MHz | — |
| Ethernet | Gigabit MAC with SGMII interface | — |
| USB | USB 2.0 High-Speed (480 Mbps) | — |
| PCI | PCI 2.3, 32-bit, up to 66 MHz | — |
| Security Engine | SEC 2.0 (DES, 3DES, AES, PKA) | AES / DES / 3DES |
| 封裝 | 516-TEPBGA (27x27 mm) with exposed pad | — |
| 供應電壓 | 1.0 V / 1.8 V / 2.5 V / 3.3 V | — |
| 工作溫度 | 0 C to 105 C (commercial / extended) | 0 °C to +105 °C |
| Silicon Revision | Rev 3 | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL 等級 | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| RoHS 狀態 | Compliant | [DATA_NEEDED: RoHS status] |
| Terminal Count | 516 (BGA) | — |
| Manufacturer | — | NXP Semiconductors / Freescale |
| Series | — | MPC83xx PowerQUICC II Pro |
| Core Count | — | 1 |
| 資料匯流排寬度 | — | 32-bit |
| Max Core Frequency | — | 267 MHz |
| Operating Voltage (Core) | — | 1.8 V |
| Operating Voltage (DDR I/O) | — | 2.5 V / 1.8 V |
| Operating Voltage (Standard I/O) | — | 3.3 V |
| Package Type | — | 516-TEPBGA (27x27 mm) |
| Ball Count | — | 516 |
| Integrated Memory Controller | — | DDR1/DDR2 up to 266 MHz |
| Integrated Ethernet | — | 10/100/1000 Mbps (3x eTSEC) |
| USB Interface | — | USB 2.0 High-Speed (Host/Device) |
| PCI Interface | — | PCI 32-bit/66 MHz + mini-PCI |