MPC8360EZUAGDGA vs MPC8360VVAGDGA Comparison
Detailed side-by-side comparison of MPC8360EZUAGDGA by NXP Semiconductors and MPC8360VVAGDGA by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MPC8360EZUAGDGA | MPC8360VVAGDGA |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | End of Life |
| Architecture | PowerPC e300 (Power Architecture) | — |
| Core Count | 1 | — |
| Data Bus Width | 32-bit | 32-bit |
| Core Clock Speed | 400 MHz | — |
| Supply Voltage | 1.2 V (core); 3.3 V (I/O) [DATA_NEEDED: exact supply rail breakdown] | — |
| Memory Interface | DDR1 / DDR2 | DDR1 / DDR2 memory controller |
| Ethernet | 1 Gbit (10/100/1000) | 1 x 10/100/1000 Mbps MAC (RGMII) |
| PCI Interface | 32-bit PCI | 32-bit PCI v2.3 |
| USB | USB 2.0 full/low-speed | 1 x USB 2.0 (host/device) |
| TDM / ATM | Yes (TDM and ATM) | — |
| Security Accelerator | SEC (crypto engine) | — |
| Package | 740-TBGA, 37.5 x 37.5 mm, 1 mm pitch | 740-TBGA (37.5 x 37.5 mm, 1 mm pitch) |
| Package Height | 1.46 mm | — |
| Lead-Free / RoHS | Lead-free (per datasheet) | — |
| Operating Temperature | 0 C to 105 C | — |
| Mounting Type | Surface Mount | Surface Mount |
| Product Family | MPC83xx PowerQUICC II Pro | — |
| Series | MPC8360E | MPC83xx (PowerQUICC II Pro) |
| Core Architecture | — | PowerPC e300 (Power Architecture technology) |
| Core Frequency | — | 400 MHz |
| Number of Cores | — | 1 |
| Core Supply Voltage (Vcore) | — | 1.2 V |
| I/O Supply Voltage | — | 1.8 / 2.5 / 3.3 V |
| Operating Temperature Range | — | 0C to +105C |
| Communications Engine | — | QUICC Engine (HDLC / ATM / TDM) |
| Serial Interfaces | — | UART, I2C, SPI, TDM |
| Lead Free / RoHS | — | No-Pb (non-ENC, NO-PB variant per Mouser listing) |