MPC8360VVAGDGA - PowerQUICC II Pro 400MHz SoC | NXP
MPN: MPC8360VVAGDGA ✗ End of LifeMPC8360VVAGDGA Overview
A communications SoC is a single silicon device that combines a microprocessor core, on-chip peripherals, memory interfaces, and dedicated communications accelerators into one package; in the case of the MPC8360VVAGDGA, that combination targets broadband access, industrial networking, and telecom line-card applications. The MPC8360 sits within the broader taxonomy: microprocessor -> MPU -> application processor -> communications SoC -> PowerQUICC family. By integrating the QUICC Engine and QUICC Engine HDLC/ATM/TDM controllers alongside the e300 core, the device eliminates the need for an external traffic-handling ASIC in many designs.
Key specifications for the MPC8360VVAGDGA include the 400 MHz e300 core frequency, 1.2 V core supply, 1.8/2.5/3.3 V I/O supply, 32-bit architecture with single core, 740-TBGA package, and an operating temperature range of 0C to 105C. On-chip peripherals include DDR1/DDR2 memory controller, 32-bit PCI v2.3 bus, one 10/100/1000 Ethernet MAC (RGMII), one USB 2.0 (host/device), local bus, and serial interfaces (UART, I2C, SPI). The integrated QUICC Engine subsystem offloads HDLC, ATM, and TDM processing from the e300 core, enabling sustained wire-speed handling of multi-channel traffic without CPU intervention.
The architecture combines a Power Architecture e300 superscalar core with a dedicated RISC communications engine, sharing an internal SoC platform bus. This dual-engine topology allows the device to handle routing protocols, encryption, and control-plane tasks on the e300 core while the QUICC Engine simultaneously processes time-critical channelized traffic, achieving deterministic throughput across voice and data workloads.
Typical applications for the MPC8360VVAGDGA include broadband CPE/SME routers, low-end DSLAM line cards, IP-PBX and IP-PSTN gateways, industrial Ethernet gateways, and ATM-to-IP protocol converters. Its integrated 1 GbE MAC plus QUICC Engine makes it well suited for hybrid TDM/IP equipment in legacy telecom infrastructure transitioning toward all-IP.
When designing with this part, note that the NXP product page reports this MPN has reached End of Life; designers should evaluate the pin-compatible MPC8358EVRAGDGA or MPC8360EVVAGDGA variants for new designs and source the MPC8360VVAGDGA from authorized distributors for legacy/field replacement purposes.
This page synthesizes EOL notices, distributor pricing, drop-in compatible variants, and PCB-level design notes that go beyond the information density found in the manufacturer datasheet alone.
Drop-in alternatives for MPC8360VVAGDGA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8360VVAGDGA (same form factor and footprint) — differing in Ethernet, PCI Interface, USB, Mounting Type, Package.
MPC8358EVRAGDGA
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8360EVVAGDGA
✅ Drop-InContact for price
View Datasheet →MPC8360CVVAGDGA
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8360ECVVAGDGA
✅ Drop-InContact for price
View Datasheet →MPC8360EZUAJDGA
✅ Drop-InContact for price
View Datasheet →MPC8360EZUAGDGA
✅ Drop-InContact for price
View Datasheet →MPC8360CZUAGDGA
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8360VVAGDGA Maximum Ratings & Electrical Characteristics
| Core Architecture | PowerPC e300 (Power Architecture technology) |
| Core Frequency | 400 MHz |
| Number of Cores | 1 |
| Data Bus Width | 32-bit |
| Series | MPC83xx (PowerQUICC II Pro) |
| Core Supply Voltage (Vcore) | 1.2 V |
| I/O Supply Voltage | 1.8 / 2.5 / 3.3 V |
| Operating Temperature Range | 0C to +105C |
| Package | 740-TBGA (37.5 x 37.5 mm, 1 mm pitch) |
| Mounting Type | Surface Mount |
| Memory Interface | DDR1 / DDR2 memory controller |
| PCI Interface | 32-bit PCI v2.3 |
| Ethernet | 1 x 10/100/1000 Mbps MAC (RGMII) |
| USB | 1 x USB 2.0 (host/device) |
| Communications Engine | QUICC Engine (HDLC / ATM / TDM) |
| Serial Interfaces | UART, I2C, SPI, TDM |
| Lead Free / RoHS | No-Pb (non-ENC, NO-PB variant per Mouser listing) |
MPC8360VVAGDGA 740-tbga (37.5 x 37.5 mm, 1 mm pitch) Pin Configuration Guide
Pin configuration for MPC8360VVAGDGA (740-tbga (37.5 x 37.5 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC8360VVAGDGA.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC8360VVAGDGA is suitable for 6 applications: SME / Broadband CPE Routers, Low-End DSLAM Line Cards, IP-PBX / IP-PSTN Gateways, Industrial Ethernet Gateways, ATM-to-IP Protocol Converters, Telecom Router Control Cards.
SME / Broadband CPE Routers
The MPC8360VVAGDGA's 400 MHz e300 core plus integrated Gigabit Ethernet MAC make it a strong fit for small-to-medium enterprise (SME) routers. With 32-bit DDR1/DDR2 controller and PCI v2.3 bus, it handles a 1 GbE WAN uplink plus multi-port LAN switching via an external GbE switch. Placed on the main control board, the QUICC Engine offloads T1/E1 channelization so the e300 core stays free for routing/firewall/NAT processing, with typical throughput exceeding 800 Mbps on small packet sizes.
Recommended
Low-End DSLAM Line Cards
In DSLAM line cards, the MPC8360VVAGDGA's QUICC Engine subsystem provides deterministic HDLC/ATM/TDM offload for hundreds of subscriber channels. Its TDM interface supports up to [DATA_NEEDED: TDM channels] per device, while the 32-bit PCI bus aggregates uplink to a control card. Compared to discrete FPGA-based line-card designs, the MPC8360VVAGDGA reduces BOM cost and PCB area while meeting the strict jitter and wander requirements of ITU-T G.823/G.824.
Recommended
IP-PBX / IP-PSTN Gateways
The MPC8360VVAGDGA's TDM interface paired with 1 GbE MAC and QUICC Engine HDLC offload enables high-density IP-PBX and IP-PSTN gateway designs that bridge legacy TDM PBX trunks to SIP-based VoIP networks. The 400 MHz e300 core comfortably runs an embedded Linux/RTOS VoIP stack (Asterisk, FreeSWITCH) at the same time as the QUICC Engine handles DS0 channelization. The 740-TBGA's 32-bit DDR2 interface supports [DATA_NEEDED: max DDR2 size] for call-detail-record buffers and firmware storage.
Recommended
Industrial Ethernet Gateways
For industrial Ethernet gateways and protocol converters, the MPC8360VVAGDGA provides the rugged 0C to +105C operating range and the integration that eliminates external bridges between Modbus-TCP, PROFINET, EtherCAT, and legacy serial fieldbuses. The PCI v2.3 bus lets designers add industrial I/O cards (digital I/O, analog I/O, isolated serial) without external glue logic. Estimated: at full utilization the SoC dissipates 4-6 W, requiring a thermal pad or heatsink in sealed enclosures.
Recommended
ATM-to-IP Protocol Converters
The MPC8360VVAGDGA's combination of QUICC Engine ATM SAR (AAL1/AAL2/AAL5) plus Gigabit Ethernet MAC makes it one of the few commercial SoCs that can be a single-chip ATM-to-IP converter for legacy DSL/cable/UMTS backhaul. The PCI v2.3 bus can host an external T1/E1 framer for the ATM PHY side, while the on-chip GbE MAC terminates the IP/Ethernet side. Designers choose this MPN over the MPC8358E variant when both ATM and TDM are required in the same SKU.
Recommended
Telecom Router Control Cards
In a multi-slot telecom router chassis the MPC8360VVAGDGA serves as a control card master processor, running routing daemons (RIP/OSPF/BGP), SNMP agents, and CLI management. The PCI v2.3 bus aggregates uplink line cards with deterministic latency; the 32-bit DDR2 controller holds route tables for IPv4/v6 forwarding. Estimated 4-6 W dissipation per chip requires active airflow in the chassis; the 740-TBGA package supports BGA socket assembly for field replacement.
Recommended
Recommended Products Summary
Engineering reference data for MPC8360VVAGDGA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8358EVRAGDGA | MPC8360EVVAGDGA | MPC8360CVVAGDGA | MPC8360EZUAJDGA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 740-TBGA (37.5x37.5 mm) | 740-TBGA (37.5x37.5 mm) - same | 740-TBGA (37.5x37.5 mm) - same | 740-TBGA (37.5x37.5 mm) - same | 740-TBGA (37.5x37.5 mm) - same |
| Core Frequency | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| Core Architecture | e300 PowerPC | e300 PowerPC | e300 PowerPC | e300 PowerPC | e300 PowerPC |
| Crypto Engine (SEC) | No | No | Yes (SEC 2.x) | No | Yes (SEC 2.x) |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | -40C to +105C (extended) |
| USB 2.0 | 1 (host/device) | 1 (host/device) | 1 (host/device) | 1 (host/device) | 1 (host/device) |
| Ethernet MAC | 1 x 10/100/1000 (RGMII) | 1 x 10/100/1000 (RGMII) | 1 x 10/100/1000 (RGMII) | 1 x 10/100/1000 (RGMII) | 1 x 10/100/1000 (RGMII) |
Key Differentiators
- Pin-compatible upgrade path with hardware crypto accelerator (vs MPC8358EVRAGDGA)
- End-of-life signal acknowledged on NXP product page (vs MPC8360EZUAJDGA)
- Single-chip ATM + IP + TDM processing (vs MPC8313VRAFFC)
Design Notes
Estimated: at 1.2 V core and 400 MHz the e300 core dissipates about 2-3 W; full-chip with DDR/PCI/Ethernet/USB active rises to 4-6 W. In a sealed indoor enclosure without airflow this requires a thermal pad bonded to the BGA's exposed die-side pad (ground) plus copper heatsink. The 0C to +105C junction range means theta_JA must stay below ~15 C/W with the heatsink to handle full 6 W at 25C ambient.
The 740-TBGA at 1.0 mm ball pitch demands 4+2 PCB stack-up with controlled-impedance (50 ohm single-ended, 100 ohm differential) routing for DDR2 SSTL_18 and PCI signals. Use micro-via-in-pad for BGA breakout; follow NXP MPC8360E design-checklist for DDR2 length matching (data/byte-clk +/- 25 mil; DQS to DQ +/- 50 mil). Power islands must be decoupled with 0402/0201 ceramics at 1 uF / 100 nF ratios placed within 50 mil of each BGA ball.
Do not power up without a correct POR sequence: Vcore must reach 1.2 V before 3.3 V I/O rises, otherwise I/O cells can latch-up. The HRESET signal must be held low until both supplies are stable. Designers commonly forget the JTAG TRST pull-down which prevents boundary-scan interference at boot. Reference NXP application note AN3640 for the full POR/Timing diagram.
Compliance Information
Mouser listing specifies 'NO-PB' (non-ENC) variant confirming lead presence; the part is therefore NOT RoHS compliant. Reach and conflict-minerals status inferred from NXP product family compliance; halogen-free status not stated. AEC-Q100 is not applicable (communications SoC).
