MPC8360EZUAGDGA vs MPC8360VVAGDGA Vergleich
Detaillierter Direktvergleich von MPC8360EZUAGDGA von NXP Semiconductors und MPC8360VVAGDGA von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC8360EZUAGDGA | MPC8360VVAGDGA |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Ende des Lebenszyklus |
| Architecture | PowerPC e300 (Power Architecture) | — |
| Core Count | 1 | — |
| Datenbusbreite | 32-bit | 32-bit |
| Core Clock Speed | 400 MHz | — |
| Versorgungsspannung | 1.2 V (core); 3.3 V (I/O) [DATA_NEEDED: exact supply rail breakdown] | — |
| Memory Interface | DDR1 / DDR2 | DDR1 / DDR2 memory controller |
| Ethernet | 1 Gbit (10/100/1000) | 1 x 10/100/1000 Mbps MAC (RGMII) |
| PCI Interface | 32-bit PCI | 32-bit PCI v2.3 |
| USB | USB 2.0 full/low-speed | 1 x USB 2.0 (host/device) |
| TDM / ATM | Yes (TDM and ATM) | — |
| Security Accelerator | SEC (crypto engine) | — |
| Gehäuse | 740-TBGA, 37.5 x 37.5 mm, 1 mm pitch | 740-TBGA (37.5 x 37.5 mm, 1 mm pitch) |
| Package Height | 1.46 mm | — |
| Lead-Free / RoHS | Lead-free (per datasheet) | — |
| Betriebstemperatur | 0 C to 105 C | — |
| Montageart | Surface Mount | Surface Mount |
| Product Family | MPC83xx PowerQUICC II Pro | — |
| Series | MPC8360E | MPC83xx (PowerQUICC II Pro) |
| Core Architecture | — | PowerPC e300 (Power Architecture technology) |
| Core Frequency | — | 400 MHz |
| Number of Cores | — | 1 |
| Core Supply Voltage (Vcore) | — | 1.2 V |
| I/O Supply Voltage | — | 1.8 / 2.5 / 3.3 V |
| Betriebstemperaturbereich | — | 0C to +105C |
| Communications Engine | — | QUICC Engine (HDLC / ATM / TDM) |
| Serial Interfaces | — | UART, I2C, SPI, TDM |
| Lead Free / RoHS | — | No-Pb (non-ENC, NO-PB variant per Mouser listing) |