MPC8360ZUAGDGA vs MPC8360ECVVAGDGA Comparison
Detailed side-by-side comparison of MPC8360ZUAGDGA by NXP Semiconductors and MPC8360ECVVAGDGA by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8360ECVVAGDGA - 400MHz PowerQUICC II Pro MPU | NXP | 740-TBGA
MPC8360ECVVAGDGA ✓ ActiveSpecification Comparison
| Parameter | MPC8360ZUAGDGA | MPC8360ECVVAGDGA |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Active |
| Processor Type | PowerPC e300 Microprocessor (MPC83xx PowerQUICC II Pro) | PowerPC e300 Microprocessor IC MPC83xx |
| Core Count | 1 | — |
| Architecture | 32-Bit Power Architecture | — |
| Core Clock Speed | 400 MHz | — |
| Core Voltage | 1.2 V | — |
| Package / Case | 740-LBGA / 740-TBGA (37.5 x 37.5 mm) | — |
| Packaging | Tray | — |
| Operating Temperature | 0 C to 105 C | — |
| Memory Interface | DDR1/DDR2 controller with ECC | — |
| Ethernet | 1 x 10/100/1000 (Gigabit Ethernet) | — |
| PCI Interface | 32-bit / 66 MHz PCI | Yes (PCI 2.2) |
| USB Interface | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| TDM / Serial | Multiple TDM channels (T1/E1/J1/HDLC/ATM) | — |
| Revision | Revision 2.x TBGA | — |
| Encryption | Non-encryption variant (no SEC 2.0) | — |
| RoHS Status | Compliant | — |
| Lead Free Status | Lead Free | — |
| Core Architecture | — | Power Architecture (PowerPC), 32-bit |
| Number of Cores | — | 1 |
| Maximum Core Frequency | — | 400 MHz |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| L2 Unified Cache | — | 256 KB |
| Memory Controller | — | DDR1/DDR2 with ECC |
| Ethernet MAC | — | Gigabit Ethernet (10/100/1000) |
| Security Engine | — | Integrated SEC (IPsec/SSL acceleration) |
| Communication Engine | — | QUICC Engine with TDM/ATM/HDLC |
| Operating Voltage (Core) | — | 1.2 V |
| Operating Temperature Range | — | -40C to +105C |
| Package | — | 740-TBGA (37.5 x 37.5 mm) |
| Mounting Type | — | Surface Mount (BGA) |
| Lead-Free Status | — | Lead-Free / RoHS compliant |
| Silicon Revision | — | 2.x (denoted by 'E' suffix) |
| MSL Level | — | [DATA_NEEDED: MSL level] |