MPC8360ZUAGDGA vs MPC8360ECVVAGDGA Comparación
Comparación detallada lado a lado de MPC8360ZUAGDGA por NXP Semiconductors y MPC8360ECVVAGDGA por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8360ECVVAGDGA - 400MHz PowerQUICC II Pro MPU | NXP | 740-TBGA
MPC8360ECVVAGDGA ✓ ActivoComparación de especificaciones
| Parámetro | MPC8360ZUAGDGA | MPC8360ECVVAGDGA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Processor Type | PowerPC e300 Microprocessor (MPC83xx PowerQUICC II Pro) | PowerPC e300 Microprocessor IC MPC83xx |
| Core Count | 1 | — |
| Architecture | 32-Bit Power Architecture | — |
| Core Clock Speed | 400 MHz | — |
| Core Voltage | 1.2 V | — |
| Encapsulado / Carcasa | 740-LBGA / 740-TBGA (37.5 x 37.5 mm) | — |
| Packaging | Tray | — |
| Temperatura de funcionamiento | 0 C to 105 C | — |
| Memory Interface | DDR1/DDR2 controller with ECC | — |
| Ethernet | 1 x 10/100/1000 (Gigabit Ethernet) | — |
| PCI Interface | 32-bit / 66 MHz PCI | Yes (PCI 2.2) |
| USB Interface | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| TDM / Serial | Multiple TDM channels (T1/E1/J1/HDLC/ATM) | — |
| Revision | Revision 2.x TBGA | — |
| Encryption | Non-encryption variant (no SEC 2.0) | — |
| Estado RoHS | Compliant | — |
| Lead Free Status | Lead Free | — |
| Core Architecture | — | Power Architecture (PowerPC), 32-bit |
| Number of Cores | — | 1 |
| Maximum Core Frequency | — | 400 MHz |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| L2 Unified Cache | — | 256 KB |
| Memory Controller | — | DDR1/DDR2 with ECC |
| Ethernet MAC | — | Gigabit Ethernet (10/100/1000) |
| Security Engine | — | Integrated SEC (IPsec/SSL acceleration) |
| Communication Engine | — | QUICC Engine with TDM/ATM/HDLC |
| Operating Voltage (Core) | — | 1.2 V |
| Rango de temperatura de funcionamiento | — | -40C to +105C |
| Encapsulado | — | 740-TBGA (37.5 x 37.5 mm) |
| Tipo de montaje | — | Surface Mount (BGA) |
| Lead-Free Status | — | Lead-Free / RoHS compliant |
| Silicon Revision | — | 2.x (denoted by 'E' suffix) |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |