MPC8360ZUAGDGA vs MPC8360ECVVAGDGA Vergleich
Detaillierter Direktvergleich von MPC8360ZUAGDGA von NXP Semiconductors und MPC8360ECVVAGDGA von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8360ECVVAGDGA - 400MHz PowerQUICC II Pro MPU | NXP | 740-TBGA
MPC8360ECVVAGDGA ✓ AktivSpezifikationsvergleich
| Parameter | MPC8360ZUAGDGA | MPC8360ECVVAGDGA |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Processor Type | PowerPC e300 Microprocessor (MPC83xx PowerQUICC II Pro) | PowerPC e300 Microprocessor IC MPC83xx |
| Core Count | 1 | — |
| Architecture | 32-Bit Power Architecture | — |
| Core Clock Speed | 400 MHz | — |
| Core Voltage | 1.2 V | — |
| Gehäuse / Bauform | 740-LBGA / 740-TBGA (37.5 x 37.5 mm) | — |
| Packaging | Tray | — |
| Betriebstemperatur | 0 C to 105 C | — |
| Memory Interface | DDR1/DDR2 controller with ECC | — |
| Ethernet | 1 x 10/100/1000 (Gigabit Ethernet) | — |
| PCI Interface | 32-bit / 66 MHz PCI | Yes (PCI 2.2) |
| USB Interface | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| TDM / Serial | Multiple TDM channels (T1/E1/J1/HDLC/ATM) | — |
| Revision | Revision 2.x TBGA | — |
| Encryption | Non-encryption variant (no SEC 2.0) | — |
| RoHS-Status | Compliant | — |
| Lead Free Status | Lead Free | — |
| Core Architecture | — | Power Architecture (PowerPC), 32-bit |
| Number of Cores | — | 1 |
| Maximum Core Frequency | — | 400 MHz |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| L2 Unified Cache | — | 256 KB |
| Memory Controller | — | DDR1/DDR2 with ECC |
| Ethernet MAC | — | Gigabit Ethernet (10/100/1000) |
| Security Engine | — | Integrated SEC (IPsec/SSL acceleration) |
| Communication Engine | — | QUICC Engine with TDM/ATM/HDLC |
| Operating Voltage (Core) | — | 1.2 V |
| Betriebstemperaturbereich | — | -40C to +105C |
| Gehäuse | — | 740-TBGA (37.5 x 37.5 mm) |
| Montageart | — | Surface Mount (BGA) |
| Lead-Free Status | — | Lead-Free / RoHS compliant |
| Silicon Revision | — | 2.x (denoted by 'E' suffix) |
| MSL-Level | — | [DATA_NEEDED: MSL level] |