MPC8360ZUAGDGA vs MPC8360ECVVAGDGA 对比

详细并排对比 MPC8360ZUAGDGA 出自 NXP Semiconductors 和 MPC8360ECVVAGDGA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC8360ZUAGDGA MPC8360ZUAGDGA - 400MHz PowerQUICC II Pro MPU | NXP

MPC8360ZUAGDGA - 400MHz PowerQUICC II Pro MPU | NXP

MPC8360ZUAGDGA ✓ 量产中
NXP Semiconductors
MPC8360ECVVAGDGA MPC8360ECVVAGDGA - 400MHz PowerQUICC II Pro MPU | NXP | 740-TBGA

MPC8360ECVVAGDGA - 400MHz PowerQUICC II Pro MPU | NXP | 740-TBGA

MPC8360ECVVAGDGA ✓ 量产中

规格对比

参数 MPC8360ZUAGDGA MPC8360ECVVAGDGA
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 有效
Processor Type PowerPC e300 Microprocessor (MPC83xx PowerQUICC II Pro) PowerPC e300 Microprocessor IC MPC83xx
Core Count 1 —
Architecture 32-Bit Power Architecture —
Core Clock Speed 400 MHz —
Core Voltage 1.2 V —
封装 / 外壳 740-LBGA / 740-TBGA (37.5 x 37.5 mm) —
Packaging Tray —
工作温度 0 C to 105 C —
Memory Interface DDR1/DDR2 controller with ECC —
Ethernet 1 x 10/100/1000 (Gigabit Ethernet) —
PCI Interface 32-bit / 66 MHz PCI Yes (PCI 2.2)
USB Interface USB 2.0 Full-Speed USB 2.0 Full-Speed
TDM / Serial Multiple TDM channels (T1/E1/J1/HDLC/ATM) —
Revision Revision 2.x TBGA —
Encryption Non-encryption variant (no SEC 2.0) —
RoHS 状态 Compliant —
Lead Free Status Lead Free —
Core Architecture — Power Architecture (PowerPC), 32-bit
Number of Cores — 1
Maximum Core Frequency — 400 MHz
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
L2 Unified Cache — 256 KB
Memory Controller — DDR1/DDR2 with ECC
Ethernet MAC — Gigabit Ethernet (10/100/1000)
Security Engine — Integrated SEC (IPsec/SSL acceleration)
Communication Engine — QUICC Engine with TDM/ATM/HDLC
Operating Voltage (Core) — 1.2 V
工作温度范围 — -40C to +105C
封装 — 740-TBGA (37.5 x 37.5 mm)
安装类型 — Surface Mount (BGA)
Lead-Free Status — Lead-Free / RoHS compliant
Silicon Revision — 2.x (denoted by 'E' suffix)
MSL 等级 — [DATA_NEEDED: MSL level]

数据手册与资源

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