MPC8541EPXAJD vs MPC8541EPXALF Comparison

Detailed side-by-side comparison of MPC8541EPXAJD by NXP Semiconductors and MPC8541EPXALF by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC8541EPXAJD MPC8541EPXAJD - PowerPC e500 MPU, 533 MHz, 783-FCPBGA | NXP

MPC8541EPXAJD - PowerPC e500 MPU, 533 MHz, 783-FCPBGA | NXP

MPC8541EPXAJD Nrnd
NXP Semiconductors
MPC8541EPXALF MPC8541EPXALF - PowerQUICC III e500 MPU 667MHz 783-FCPBGA | NXP

MPC8541EPXALF - PowerQUICC III e500 MPU 667MHz 783-FCPBGA | NXP

MPC8541EPXALF ⚠ Last Time Buy

Specification Comparison

Parameter MPC8541EPXAJD MPC8541EPXALF
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Last Time Buy
Core Architecture PowerPC e500 PowerPC e500, 32-bit
Core Count 1 —
Data Bus Width 32-bit 64-bit
Maximum Core Frequency 533 MHz —
Series MPC85xx (PowerQUICC III) PowerQUICC III (MPC85xx)
Package 783-FCPBGA (29x29 mm) —
Mounting Type Surface Mount Surface Mount (Flip-Chip BGA)
Terminal Form BALL —
Number of Terminals 783 —
Package Code HBGA —
Ethernet Dual 10/100/1000 Mbps (TSEC) —
Memory Controller DDR/DDR2 SDRAM 64-bit DDR/DDR2 with ECC
PCI/PCI-X Dual PCI/PCI-X interface —
Security Engine (SEC) Integrated crypto accelerator —
Operating Temperature Grade OTHER (extended) —
RoHS Status Compliant (per NXP product page) Compliant
Manufacturer — NXP Semiconductors (formerly Freescale)
Core Frequency — 667 MHz
Supply Voltage — 1.2 V (core); 2.5 V / 3.3 V (I/O)
Operating Temperature — 0C to +105C
Package Type — FCBGA-783 (29 x 29 mm, 1 mm pitch, Flip-Chip)
Pin Count — 783
L1 Cache — 32 KB instruction + 32 KB data
L2 Cache — 256 KB unified with ECC
Ethernet Controllers — 3 x eTSEC (10/100/1000 Mbps)
Security Engine — SEC 2.0 (DES/3DES/AES/SHA)
Lead Free — Yes

Datasheets & Resources

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