MPC860DEVR80D4 vs MPC860TZQ80D4 Comparison
Detailed side-by-side comparison of MPC860DEVR80D4 by NXP Semiconductors and MPC860TZQ80D4 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC860DEVR80D4 - PowerQUICC MPU 80MHz 357-PBGA | NXP
MPC860DEVR80D4 ✗ End of Life
Specification Comparison
| Parameter | MPC860DEVR80D4 | MPC860TZQ80D4 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | End of Life | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $17.40 | $24.40 |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC MPC8xx | — |
| Core Architecture | PowerPC 32-bit RISC | PowerPC 32-bit |
| Core Count | 1 | — |
| Data Bus Width | 32-bit | — |
| Maximum Clock Frequency | 80 MHz | — |
| Operating Process Technology | 0.32 um CMOS | — |
| Package Type | 357-PBGA (25 x 25 mm) | — |
| Mounting Type | Surface Mount | Surface Mount |
| Peripheral Family | MPC8xx Communications Processor Module (CPM) | — |
| On-chip Peripherals | Ethernet, SCC, SMC, SPI, I2C, timers | — |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | -40 C to +95 C (industrial grade per suffix T) |
| Supply Voltage | [DATA_NEEDED: core and I/O supply voltage] | — |
| RoHS Status | Compliant (lead-free VR suffix) | RoHS non-compliant (legacy PBGA, contains lead) |
| Lifecycle Status | End of Life (per NXP product page) | — |
| MSL Level | [DATA_NEEDED: moisture sensitivity level] | — |
| Processor Type | — | MPC8xx PowerQUICC, 32-Bit |
| Core Frequency | — | 80 MHz |
| Bus Width | — | 32-bit |
| Operating Voltage | — | 3.3 V |
| Number of Cores | — | 1 |
| Cache Memory | — | [DATA_NEEDED: unified cache size in KB] |
| Serial Communications Controllers (SCC) | — | 4 channels |
| Serial Management Controllers (SMC) | — | 2 channels |
| SPI Controllers | — | 2 |
| I2C Interface | — | 1 |
| Package | — | 357-BGA (PBGA), 25 x 25 mm |
| Lead Status | — | Contains Lead (legacy PBGA) |
| Packaging | — | Tray |
| Process Technology | — | 0.25 micron CMOS |