MPC860DEVR80D4 vs MPC860TZQ80D4 Comparaison
Comparaison détaillée côte à côte de MPC860DEVR80D4 par NXP Semiconductors et MPC860TZQ80D4 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MPC860DEVR80D4 | MPC860TZQ80D4 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | Fin de vie |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $17,40 | $24,40 |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC MPC8xx | — |
| Core Architecture | PowerPC 32-bit RISC | PowerPC 32-bit |
| Core Count | 1 | — |
| Largeur du bus de données | 32-bit | — |
| Fréquence d'horloge maximale | 80 MHz | — |
| Operating Process Technology | 0.32 um CMOS | — |
| Package Type | 357-PBGA (25 x 25 mm) | — |
| Type de montage | Surface Mount | Surface Mount |
| Peripheral Family | MPC8xx Communications Processor Module (CPM) | — |
| On-chip Peripherals | Ethernet, SCC, SMC, SPI, I2C, timers | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | -40 C to +95 C (industrial grade per suffix T) |
| Tension d'alimentation | [DATA_NEEDED: core and I/O supply voltage] | — |
| Statut RoHS | Compliant (lead-free VR suffix) | RoHS non-compliant (legacy PBGA, contains lead) |
| Statut du cycle de vie | End of Life (per NXP product page) | — |
| Niveau MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Processor Type | — | MPC8xx PowerQUICC, 32-Bit |
| Core Frequency | — | 80 MHz |
| Bus Width | — | 32-bit |
| Operating Voltage | — | 3.3 V |
| Number of Cores | — | 1 |
| Cache Memory | — | [DATA_NEEDED: unified cache size in KB] |
| Serial Communications Controllers (SCC) | — | 4 channels |
| Serial Management Controllers (SMC) | — | 2 channels |
| SPI Controllers | — | 2 |
| I2C Interface | — | 1 |
| Boîtier | — | 357-BGA (PBGA), 25 x 25 mm |
| Lead Status | — | Contains Lead (legacy PBGA) |
| Packaging | — | Tray |
| Process Technology | — | 0.25 micron CMOS |