MPC860DEVR80D4 vs MPC860TZQ80D4 Comparación
Comparación detallada lado a lado de MPC860DEVR80D4 por NXP Semiconductors y MPC860TZQ80D4 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC860DEVR80D4 - PowerQUICC MPU 80MHz 357-PBGA | NXP
MPC860DEVR80D4 ✗ Fin de vida
Comparación de especificaciones
| Parámetro | MPC860DEVR80D4 | MPC860TZQ80D4 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,40 | $24,40 |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC MPC8xx | — |
| Core Architecture | PowerPC 32-bit RISC | PowerPC 32-bit |
| Core Count | 1 | — |
| Ancho del bus de datos | 32-bit | — |
| Frecuencia de reloj máxima | 80 MHz | — |
| Operating Process Technology | 0.32 um CMOS | — |
| Package Type | 357-PBGA (25 x 25 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Peripheral Family | MPC8xx Communications Processor Module (CPM) | — |
| On-chip Peripherals | Ethernet, SCC, SMC, SPI, I2C, timers | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | -40 C to +95 C (industrial grade per suffix T) |
| Tensión de alimentación | [DATA_NEEDED: core and I/O supply voltage] | — |
| Estado RoHS | Compliant (lead-free VR suffix) | RoHS non-compliant (legacy PBGA, contains lead) |
| Estado del ciclo de vida | End of Life (per NXP product page) | — |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Processor Type | — | MPC8xx PowerQUICC, 32-Bit |
| Core Frequency | — | 80 MHz |
| Bus Width | — | 32-bit |
| Operating Voltage | — | 3.3 V |
| Number of Cores | — | 1 |
| Cache Memory | — | [DATA_NEEDED: unified cache size in KB] |
| Serial Communications Controllers (SCC) | — | 4 channels |
| Serial Management Controllers (SMC) | — | 2 channels |
| SPI Controllers | — | 2 |
| I2C Interface | — | 1 |
| Encapsulado | — | 357-BGA (PBGA), 25 x 25 mm |
| Lead Status | — | Contains Lead (legacy PBGA) |
| Packaging | — | Tray |
| Process Technology | — | 0.25 micron CMOS |