MPC860PZQ80D4R2518 vs MPC860PZQ66D4 对比
详细并排对比 MPC860PZQ80D4R2518 出自 NXP Semiconductors 和 MPC860PZQ66D4 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC860PZQ80D4R2518 - PowerQUICC 80MHz SoC | NXP | 357-PBGA
MPC860PZQ80D4R2518 Nrnd规格对比
| 参数 | MPC860PZQ80D4R2518 | MPC860PZQ66D4 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 停产 |
| Series | PowerQUICC MPC860 | PowerQUICC |
| Core Architecture | 32-bit PowerPC (Power Architecture) | 32-bit PowerPC |
| Core Count | 1 | 1 |
| Maximum Core Frequency | 80 MHz | — |
| On-Chip Communications Module (CPM) | Yes (RISC engine for protocol acceleration) | — |
| Ethernet MAC | 10/100 Mbps with MII | — |
| HDLC/SDLC Controllers | Multiple SCCs with HDLC support | — |
| ATM Support | Yes (via CPM SAR) | — |
| PCMCIA Interface | Yes | — |
| Serial Communications Controllers (SCC) | 2 | — |
| Serial Management Controllers (SMC) | 2 | — |
| SPI / I2C | 1 SPI, 1 I2C | — |
| DMA Channels | 4 | — |
| 封装 | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) |
| 工作温度 | 0C to +95C | -40C to +95C (industrial, per D4 revision) |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Non-Compliant (Contains Lead) |
| 电源电压 | [DATA_NEEDED: core and I/O voltage rails] | — |
| Processor Family | — | PowerQUICC MPC8xx |
| Maximum CPU Clock | — | 66 MHz |
| 工作电源电压 | — | 3.3 V |
| Lead Status | — | Contains Lead (non-RoHS) |
| Packaging | — | Tray |
| On-chip Communications Module | — | CPM with SCCs, SMCs, Ethernet, HDLC |
| Memory Controller | — | DRAM, SRAM, Flash, EPROM |
| Timers | — | 4 x 16-bit |
| Process Technology | — | 0.32 um CMOS |
| MSL 等级 | — | 3 |