MPC860TZQ80D4 vs MPC860TVR80D4 Comparison
Detailed side-by-side comparison of MPC860TZQ80D4 by NXP Semiconductors and MPC860TVR80D4 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MPC860TZQ80D4 | MPC860TVR80D4 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | End of Life | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $24.40 | $14.85 |
| Processor Type | MPC8xx PowerQUICC, 32-Bit | MPC8xx PowerQUICC, 32-bit RISC |
| Core Architecture | PowerPC 32-bit | PowerPC + CPM (RISC communications processor) |
| Core Frequency | 80 MHz | 80 MHz |
| Bus Width | 32-bit | — |
| Operating Voltage | 3.3 V | 3.3 V |
| Number of Cores | 1 | 1 |
| Cache Memory | [DATA_NEEDED: unified cache size in KB] | — |
| Serial Communications Controllers (SCC) | 4 channels | — |
| Serial Management Controllers (SMC) | 2 channels | — |
| SPI Controllers | 2 | — |
| I2C Interface | 1 | — |
| Package | 357-BGA (PBGA), 25 x 25 mm | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Operating Temperature | -40 C to +95 C (industrial grade per suffix T) | [DATA_NEEDED: operating temperature range] |
| Lead Status | Contains Lead (legacy PBGA) | — |
| RoHS Status | RoHS non-compliant (legacy PBGA, contains lead) | RoHS Compliant |
| Packaging | Tray | Tray |
| Process Technology | 0.25 micron CMOS | 0.32 micrometer CMOS |
| Package / Case | — | 357-BGA (PBGA 25x25 mm) |
| Instruction Cache | — | 4 KB |
| Data Cache | — | 4 KB |
| Communication Controllers | — | 3 FCC, 4 SCC, 2 SMC |
| Ethernet MAC | — | 10/100 Mbps integrated |
| Memory Controller | — | DRAM, SRAM, Flash, EDO support |
| Lead Free Status | — | Lead Free |