MPC860TZQ80D4 vs MPC860TVR80D4 Vergleich
Detaillierter Direktvergleich von MPC860TZQ80D4 von NXP Semiconductors und MPC860TVR80D4 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC860TZQ80D4 | MPC860TVR80D4 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $24,40 | $14,85 |
| Processor Type | MPC8xx PowerQUICC, 32-Bit | MPC8xx PowerQUICC, 32-bit RISC |
| Core Architecture | PowerPC 32-bit | PowerPC + CPM (RISC communications processor) |
| Core Frequency | 80 MHz | 80 MHz |
| Bus Width | 32-bit | — |
| Operating Voltage | 3.3 V | 3.3 V |
| Number of Cores | 1 | 1 |
| Cache Memory | [DATA_NEEDED: unified cache size in KB] | — |
| Serial Communications Controllers (SCC) | 4 channels | — |
| Serial Management Controllers (SMC) | 2 channels | — |
| SPI Controllers | 2 | — |
| I2C Interface | 1 | — |
| Gehäuse | 357-BGA (PBGA), 25 x 25 mm | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebstemperatur | -40 C to +95 C (industrial grade per suffix T) | [DATA_NEEDED: operating temperature range] |
| Lead Status | Contains Lead (legacy PBGA) | — |
| RoHS-Status | RoHS non-compliant (legacy PBGA, contains lead) | RoHS Compliant |
| Packaging | Tray | Tray |
| Process Technology | 0.25 micron CMOS | 0.32 micrometer CMOS |
| Gehäuse / Bauform | — | 357-BGA (PBGA 25x25 mm) |
| Instruction Cache | — | 4 KB |
| Data Cache | — | 4 KB |
| Communication Controllers | — | 3 FCC, 4 SCC, 2 SMC |
| Ethernet MAC | — | 10/100 Mbps integrated |
| Memory Controller | — | DRAM, SRAM, Flash, EDO support |
| Lead Free Status | — | Lead Free |