MPC860TZQ80D4 vs MPC860TVR80D4 对比

详细并排对比 MPC860TZQ80D4 出自 NXP Semiconductors 和 MPC860TVR80D4 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC860TZQ80D4 MPC860TZQ80D4 - 80MHz PowerQUICC MPU, 357-BGA | NXP

MPC860TZQ80D4 - 80MHz PowerQUICC MPU, 357-BGA | NXP

MPC860TZQ80D4 ✗ 停产
NXP Semiconductors
MPC860TVR80D4 MPC860TVR80D4 - 80 MHz PowerQUICC MPC8xx MPU | NXP

MPC860TVR80D4 - 80 MHz PowerQUICC MPC8xx MPU | NXP

MPC860TVR80D4 ✗ 停产

规格对比

参数 MPC860TZQ80D4 MPC860TVR80D4
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 停产 停产
库存状态 有库存 有库存
单价(USD) $24.40 $14.85
Processor Type MPC8xx PowerQUICC, 32-Bit MPC8xx PowerQUICC, 32-bit RISC
Core Architecture PowerPC 32-bit PowerPC + CPM (RISC communications processor)
Core Frequency 80 MHz 80 MHz
Bus Width 32-bit —
Operating Voltage 3.3 V 3.3 V
Number of Cores 1 1
Cache Memory [DATA_NEEDED: unified cache size in KB] —
Serial Communications Controllers (SCC) 4 channels —
Serial Management Controllers (SMC) 2 channels —
SPI Controllers 2 —
I2C Interface 1 —
封装 357-BGA (PBGA), 25 x 25 mm —
安装类型 Surface Mount Surface Mount (BGA)
工作温度 -40 C to +95 C (industrial grade per suffix T) [DATA_NEEDED: operating temperature range]
Lead Status Contains Lead (legacy PBGA) —
RoHS 状态 RoHS non-compliant (legacy PBGA, contains lead) RoHS Compliant
Packaging Tray Tray
Process Technology 0.25 micron CMOS 0.32 micrometer CMOS
封装 / 外壳 — 357-BGA (PBGA 25x25 mm)
Instruction Cache — 4 KB
Data Cache — 4 KB
Communication Controllers — 3 FCC, 4 SCC, 2 SMC
Ethernet MAC — 10/100 Mbps integrated
Memory Controller — DRAM, SRAM, Flash, EDO support
Lead Free Status — Lead Free

数据手册与资源

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