MPC870VR66 vs MPC875ZT133 Comparison
Detailed side-by-side comparison of MPC870VR66 by NXP Semiconductors and MPC875ZT133 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC875ZT133 - PowerQUICC 133MHz 32-Bit MPU | NXP Semiconductors
MPC875ZT133 ✗ End of LifeSpecification Comparison
| Parameter | MPC870VR66 | MPC875ZT133 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $25.90 | $19.85 |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC, MPC8xx | — |
| Core Processor | MPC8xx Power Architecture | — |
| Core Count | 1 | 1 |
| Data Bus Width | 32-bit | — |
| Speed | 66 MHz | — |
| Performance | 87 MIPS | — |
| Operating Supply Voltage | 3.3 V | — |
| Operating Temperature Range | 0C to +95C | — |
| Package / Case | 256-BGA (PBGA), 23x23 mm | — |
| Mounting Type | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| RoHS Status | RoHS Compliant | [DATA_NEEDED: rohs status] |
| Processor Type | MPC8xx PowerQUICC Communications Processor | — |
| Core Architecture | — | Power Architecture (PowerPC) 32-bit |
| Core Frequency | — | 133 MHz |
| Family | — | MPC8xx / PowerQUICC |
| Package | — | 256-ball PBGA (23x23 mm) |
| Package Code | — | HBGA, Grid Array with Heat Sink/Slug |
| Operating Temperature | — | 0C to +95C |
| Maximum Supply Voltage | — | 1.9 V |
| Terminal Form | — | BALL |
| Number of Terminals | — | 256 |
| Communications Processor Module (CPM) | — | Yes (on-chip) |
| Ethernet MAC | — | 10/100 Mbps (Fast Ethernet, integrated) |
| Memory Controller | — | External SDRAM/Flash bus (integrated) |
| Lifecycle Status | — | End of Life (per NXP discontinuance notice) |
| Instruction Set | — | Power Architecture 32-bit |