MPC870VR66 vs MPC875ZT133 比較
詳細並排比較 MPC870VR66 由 NXP Semiconductors 與 MPC875ZT133 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MPC870VR66 | MPC875ZT133 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | 停產終止 |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC, MPC8xx | — |
| Core Processor | MPC8xx Power Architecture | — |
| Core Count | 1 | 1 |
| 資料匯流排寬度 | 32-bit | — |
| Speed | 66 MHz | — |
| Performance | 87 MIPS | — |
| 工作電源電壓 | 3.3 V | — |
| 工作溫度範圍 | 0C to +95C | — |
| 封裝 / 外殼 | 256-BGA (PBGA), 23x23 mm | — |
| 安裝類型 | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| RoHS 狀態 | RoHS Compliant | [DATA_NEEDED: rohs status] |
| Processor Type | MPC8xx PowerQUICC Communications Processor | — |
| Core Architecture | — | Power Architecture (PowerPC) 32-bit |
| Core Frequency | — | 133 MHz |
| Family | — | MPC8xx / PowerQUICC |
| 封裝 | — | 256-ball PBGA (23x23 mm) |
| Package Code | — | HBGA, Grid Array with Heat Sink/Slug |
| 工作溫度 | — | 0C to +95C |
| Maximum Supply Voltage | — | 1.9 V |
| Terminal Form | — | BALL |
| Number of Terminals | — | 256 |
| Communications Processor Module (CPM) | — | Yes (on-chip) |
| Ethernet MAC | — | 10/100 Mbps (Fast Ethernet, integrated) |
| Memory Controller | — | External SDRAM/Flash bus (integrated) |
| 生命週期狀態 | — | End of Life (per NXP discontinuance notice) |
| Instruction Set | — | Power Architecture 32-bit |