MPC875CVR133 vs MPC875VR133 Comparison

Detailed side-by-side comparison of MPC875CVR133 by NXP Semiconductors and MPC875VR133 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC875VR133 MPC875VR133 - PowerQUICC 133MHz 32-Bit MPU | NXP

MPC875VR133 - PowerQUICC 133MHz 32-Bit MPU | NXP

MPC875VR133 Obsolete

Specification Comparison

Parameter MPC875CVR133 MPC875VR133
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $43.75 $27.90
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors (formerly Freescale Semiconductor)
Product Category Microprocessors (MPU) —
Processor Series MPC8xx / PowerQUICC —
Core MPC8xx (Power Architecture Technology) —
Data Bus Width 32-bit 32 bit
Maximum Clock Frequency 133 MHz —
Performance 176 MIPS 176 MIPS
Number of Cores 1 —
Core Supply Voltage 1.8 V —
I/O Supply Voltage 3.3 V —
Operating Temperature -40C to +100C 0 °C to +95 °C
Package 256-PBGA (23 mm x 23 mm, 1.27 mm pitch) —
Mounting Type Surface Mount Surface Mount (BGA)
On-chip Communication Processor Module (CPM) Yes (FCC/SCC/SMC/USB/FEC/ATM) —
RoHS Status [DATA_NEEDED: rohs status] [DATA_NEEDED: RoHS status]
MSL Level [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
Series — PowerQUICC, MPC8xx
Core Architecture — Power Architecture (32-bit RISC)
Core Count — 1
Core Frequency — 133 MHz
Process Technology — 0.18 µm CMOS
Supply Voltage (I/O) — 3.3 V
Package Type — 256-PBGA (HBGA), 23x23 mm
Terminal Pitch — 1.27 mm
On-chip Communications — CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII
Memory Controller — SDRAM, Flash, SRAM, ROM support
PCI Bridge — Integrated (PCI 2.1)

Datasheets & Resources

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