MPC875CVR133 vs MPC875VR133 Vergleich
Detaillierter Direktvergleich von MPC875CVR133 von NXP Semiconductors und MPC875VR133 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC875CVR133 | MPC875VR133 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $43,75 | $27,90 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Product Category | Microprocessors (MPU) | — |
| Processor Series | MPC8xx / PowerQUICC | — |
| Core | MPC8xx (Power Architecture Technology) | — |
| Datenbusbreite | 32-bit | 32 bit |
| Maximale Taktfrequenz | 133 MHz | — |
| Performance | 176 MIPS | 176 MIPS |
| Number of Cores | 1 | — |
| Core Supply Voltage | 1.8 V | — |
| I/O Supply Voltage | 3.3 V | — |
| Betriebstemperatur | -40C to +100C | 0 °C to +95 °C |
| Gehäuse | 256-PBGA (23 mm x 23 mm, 1.27 mm pitch) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| On-chip Communication Processor Module (CPM) | Yes (FCC/SCC/SMC/USB/FEC/ATM) | — |
| RoHS-Status | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| MSL-Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Series | — | PowerQUICC, MPC8xx |
| Core Architecture | — | Power Architecture (32-bit RISC) |
| Core Count | — | 1 |
| Core Frequency | — | 133 MHz |
| Process Technology | — | 0.18 µm CMOS |
| Supply Voltage (I/O) | — | 3.3 V |
| Package Type | — | 256-PBGA (HBGA), 23x23 mm |
| Terminal Pitch | — | 1.27 mm |
| On-chip Communications | — | CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII |
| Memory Controller | — | SDRAM, Flash, SRAM, ROM support |
| PCI Bridge | — | Integrated (PCI 2.1) |