MPC880CZP66 vs MPC885CZP66 Comparison

Detailed side-by-side comparison of MPC880CZP66 by NXP Semiconductors and MPC885CZP66 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC880CZP66 MPC880CZP66 - 32-Bit PowerQUICC MPU, 66MHz, 357-PBGA | NXP

MPC880CZP66 - 32-Bit PowerQUICC MPU, 66MHz, 357-PBGA | NXP

MPC880CZP66 ⚠ Last Time Buy
NXP Semiconductors
MPC885CZP66 MPC885CZP66 - 66MHz PowerQUICC MPU, 32-Bit, 357-BGA | NXP

MPC885CZP66 - 66MHz PowerQUICC MPU, 32-Bit, 357-BGA | NXP

MPC885CZP66 Nrnd

Specification Comparison

Parameter MPC880CZP66 MPC885CZP66
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Last Time Buy NRND
Stock Status In Stock In Stock
Unit Price (USD) $27.85 $18.40
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors
Product Category Microprocessors - MPU —
Series MPC8xx (PowerQUICC) PowerQUICC, MPC8xx
Core MPC8xx (PowerPC) —
Core Count 1 1
Data Bus Width 32 bit 32 bit
Maximum Clock Frequency 66.67 MHz —
Nominal Supply Voltage 1.8 V —
Package Type 357-PBGA (25x25 mm) PBGA (Plastic Ball Grid Array)
Package Code BGA (Plastic Ball Grid Array) BGA
Terminal Form Ball Ball
Number of Terminals 357 —
Mounting Type Surface Mount Surface Mount
Terminal Finish Tin/Lead (Sn/Pb) - non-RoHS —
Operating Temperature Range [DATA_NEEDED: extended industrial or commercial range] —
RoHS Status Non-compliant (Sn/Pb finish) [DATA_NEEDED: RoHS compliance status]
Core Architecture — Power Architecture, 32-bit
Core Clock Speed — 66 MHz
Process Technology — 0.18 micrometer CMOS
Supply Voltage — 3.3 V (typical)
Package Pin Count — 357
Package Size — 25 x 25 mm
Moisture Sensitivity Level — MSL 3
Operating Temperature — -40C to +100C
Package Shape — Square
Lead-Free — [DATA_NEEDED: lead-free status]

Datasheets & Resources

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