MPC880CZP66 vs MPC885CZP66 对比

详细并排对比 MPC880CZP66 出自 NXP Semiconductors 和 MPC885CZP66 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC880CZP66 MPC880CZP66 - 32-Bit PowerQUICC MPU, 66MHz, 357-PBGA | NXP

MPC880CZP66 - 32-Bit PowerQUICC MPU, 66MHz, 357-PBGA | NXP

MPC880CZP66 ⚠ 最后一次采购
NXP Semiconductors
MPC885CZP66 MPC885CZP66 - 66MHz PowerQUICC MPU, 32-Bit, 357-BGA | NXP

MPC885CZP66 - 66MHz PowerQUICC MPU, 32-Bit, 357-BGA | NXP

MPC885CZP66 Nrnd

规格对比

参数 MPC880CZP66 MPC885CZP66
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 最后采购期 不推荐新设计
库存状态 有库存 有库存
单价(USD) $27.85 $18.40
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors
Product Category Microprocessors - MPU —
Series MPC8xx (PowerQUICC) PowerQUICC, MPC8xx
Core MPC8xx (PowerPC) —
Core Count 1 1
数据总线宽度 32 bit 32 bit
最大时钟频率 66.67 MHz —
Nominal Supply Voltage 1.8 V —
Package Type 357-PBGA (25x25 mm) PBGA (Plastic Ball Grid Array)
Package Code BGA (Plastic Ball Grid Array) BGA
Terminal Form Ball Ball
Number of Terminals 357 —
安装类型 Surface Mount Surface Mount
Terminal Finish Tin/Lead (Sn/Pb) - non-RoHS —
工作温度范围 [DATA_NEEDED: extended industrial or commercial range] —
RoHS 状态 Non-compliant (Sn/Pb finish) [DATA_NEEDED: RoHS compliance status]
Core Architecture — Power Architecture, 32-bit
Core Clock Speed — 66 MHz
Process Technology — 0.18 micrometer CMOS
电源电压 — 3.3 V (typical)
Package Pin Count — 357
Package Size — 25 x 25 mm
Moisture Sensitivity Level — MSL 3
工作温度 — -40C to +100C
Package Shape — Square
Lead-Free — [DATA_NEEDED: lead-free status]

数据手册与资源

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