MPC880CZP66 vs MPC885CZP66 Vergleich
Detaillierter Direktvergleich von MPC880CZP66 von NXP Semiconductors und MPC885CZP66 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC880CZP66 - 32-Bit PowerQUICC MPU, 66MHz, 357-PBGA | NXP
MPC880CZP66 ⚠ Letzte Bestellmöglichkeit
Spezifikationsvergleich
| Parameter | MPC880CZP66 | MPC885CZP66 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $27,85 | $18,40 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors |
| Product Category | Microprocessors - MPU | — |
| Series | MPC8xx (PowerQUICC) | PowerQUICC, MPC8xx |
| Core | MPC8xx (PowerPC) | — |
| Core Count | 1 | 1 |
| Datenbusbreite | 32 bit | 32 bit |
| Maximale Taktfrequenz | 66.67 MHz | — |
| Nominal Supply Voltage | 1.8 V | — |
| Package Type | 357-PBGA (25x25 mm) | PBGA (Plastic Ball Grid Array) |
| Package Code | BGA (Plastic Ball Grid Array) | BGA |
| Terminal Form | Ball | Ball |
| Number of Terminals | 357 | — |
| Montageart | Surface Mount | Surface Mount |
| Terminal Finish | Tin/Lead (Sn/Pb) - non-RoHS | — |
| Betriebstemperaturbereich | [DATA_NEEDED: extended industrial or commercial range] | — |
| RoHS-Status | Non-compliant (Sn/Pb finish) | [DATA_NEEDED: RoHS compliance status] |
| Core Architecture | — | Power Architecture, 32-bit |
| Core Clock Speed | — | 66 MHz |
| Process Technology | — | 0.18 micrometer CMOS |
| Versorgungsspannung | — | 3.3 V (typical) |
| Package Pin Count | — | 357 |
| Package Size | — | 25 x 25 mm |
| Moisture Sensitivity Level | — | MSL 3 |
| Betriebstemperatur | — | -40C to +100C |
| Package Shape | — | Square |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |