MPC880ZP80 vs MPC880ZP66 Comparison
Detailed side-by-side comparison of MPC880ZP80 by NXP Semiconductors and MPC880ZP66 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MPC880ZP80 | MPC880ZP66 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Obsolete | Obsolete |
| Core Architecture | PowerPC (MPC8xx family) | — |
| Data Bus Width | 32-bit | — |
| Maximum Core Frequency | 80 MHz | — |
| Number of Cores | 1 | — |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| Ethernet MACs | 2 (10/100 Mbps Fast Ethernet Controller) | — |
| USB Interface | USB 1.1 (host + slave) | — |
| Serial Communications Controllers (SCC) | 2 (per datasheet family) | — |
| Serial Management Controllers (SMC) | 2 (per datasheet family) | — |
| PCMCIA Controller | Yes (2 ports) | — |
| Memory Controller | DRAM/Flash/SRAM, 32-bit | — |
| Operating Voltage - Core | [DATA_NEEDED: core voltage] | — |
| Operating Voltage - I/O | 3.3 V | — |
| Package | 357-PBGA (25x25 mm) | — |
| Mounting Type | Surface Mount | Surface mount |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | 0 C to 95 C |
| Process Technology | CMOS | — |
| Lead Free / RoHS | [DATA_NEEDED: RoHS status] | — |
| MSL Level | [DATA_NEEDED: MSL level] | — |
| Lifecycle | Obsolete (Rochester Electronics stocking) | — |
| Processor Type | — | MPC8xx PowerQUICC communications microprocessor |
| Architecture | — | Power Architecture |
| Core Count | — | 1 core |
| Data Width | — | 32 bit |
| Maximum Clock Frequency | — | 66 MHz |
| Supply Voltage | — | 3.3 V |
| Package Type | — | 357-PBGA (25 x 25 mm) |
| Package Pin Count | — | 357 pins |
| Packaging | — | Tray |
| RoHS Status | — | RoHS |
| Lead-Free Status | — | Contains Lead |
| Output Current | — | [DATA_NEEDED: processor output current specification] |
| Internal Memory | — | [DATA_NEEDED: internal memory configuration] |
| External Memory Interface | — | [DATA_NEEDED: external memory interface details] |
| Communications Peripherals | — | [DATA_NEEDED: communications peripheral list] |
| Maximum Power Dissipation | — | [DATA_NEEDED: maximum power dissipation] |
| Thermal Resistance | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |
| Supply Current | — | [DATA_NEEDED: operating supply current] |