MPC880ZP80 vs MPC880ZP66 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MPC880ZP80 بواسطة NXP Semiconductors و MPC880ZP66 بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | MPC880ZP80 | MPC880ZP66 |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | Obsolete | Obsolete |
| Core Architecture | PowerPC (MPC8xx family) | — |
| عرض ناقل البيانات | 32-bit | — |
| Maximum Core Frequency | 80 MHz | — |
| Number of Cores | 1 | — |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| Ethernet MACs | 2 (10/100 Mbps Fast Ethernet Controller) | — |
| USB Interface | USB 1.1 (host + slave) | — |
| Serial Communications Controllers (SCC) | 2 (per datasheet family) | — |
| Serial Management Controllers (SMC) | 2 (per datasheet family) | — |
| PCMCIA Controller | Yes (2 ports) | — |
| Memory Controller | DRAM/Flash/SRAM, 32-bit | — |
| Operating Voltage - Core | [DATA_NEEDED: core voltage] | — |
| Operating Voltage - I/O | 3.3 V | — |
| العلبة | 357-PBGA (25x25 mm) | — |
| نوع التركيب | Surface Mount | Surface mount |
| نطاق درجة حرارة التشغيل | [DATA_NEEDED: operating temperature range] | 0 C to 95 C |
| Process Technology | CMOS | — |
| Lead Free / RoHS | [DATA_NEEDED: RoHS status] | — |
| مستوى MSL | [DATA_NEEDED: MSL level] | — |
| Lifecycle | Obsolete (Rochester Electronics stocking) | — |
| Processor Type | — | MPC8xx PowerQUICC communications microprocessor |
| Architecture | — | Power Architecture |
| Core Count | — | 1 core |
| Data Width | — | 32 bit |
| أقصى تردد للساعة | — | 66 MHz |
| جهد التغذية | — | 3.3 V |
| Package Type | — | 357-PBGA (25 x 25 mm) |
| Package Pin Count | — | 357 pins |
| Packaging | — | Tray |
| حالة RoHS | — | RoHS |
| Lead-Free Status | — | Contains Lead |
| Output Current | — | [DATA_NEEDED: processor output current specification] |
| Internal Memory | — | [DATA_NEEDED: internal memory configuration] |
| External Memory Interface | — | [DATA_NEEDED: external memory interface details] |
| Communications Peripherals | — | [DATA_NEEDED: communications peripheral list] |
| Maximum Power Dissipation | — | [DATA_NEEDED: maximum power dissipation] |
| المقاومة الحرارية | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |
| تيار التغذية | — | [DATA_NEEDED: operating supply current] |