MPC880ZP80 vs MPC880ZP66 Perbandingan
Perbandingan bersamaan detil MPC880ZP80 dari NXP Semiconductors dan MPC880ZP66 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC880ZP80 | MPC880ZP66 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Core Architecture | PowerPC (MPC8xx family) | — |
| Lebar Bus Data | 32-bit | — |
| Maximum Core Frequency | 80 MHz | — |
| Number of Cores | 1 | — |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| Ethernet MACs | 2 (10/100 Mbps Fast Ethernet Controller) | — |
| USB Interface | USB 1.1 (host + slave) | — |
| Serial Communications Controllers (SCC) | 2 (per datasheet family) | — |
| Serial Management Controllers (SMC) | 2 (per datasheet family) | — |
| PCMCIA Controller | Yes (2 ports) | — |
| Memory Controller | DRAM/Flash/SRAM, 32-bit | — |
| Operating Voltage - Core | [DATA_NEEDED: core voltage] | — |
| Operating Voltage - I/O | 3.3 V | — |
| Paket | 357-PBGA (25x25 mm) | — |
| Tipe Mounting | Surface Mount | Surface mount |
| Rentang Suhu Kerja | [DATA_NEEDED: operating temperature range] | 0 C to 95 C |
| Process Technology | CMOS | — |
| Lead Free / RoHS | [DATA_NEEDED: RoHS status] | — |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Lifecycle | Obsolete (Rochester Electronics stocking) | — |
| Processor Type | — | MPC8xx PowerQUICC communications microprocessor |
| Architecture | — | Power Architecture |
| Core Count | — | 1 core |
| Data Width | — | 32 bit |
| Frekuensi Bawah Maximum | — | 66 MHz |
| Tegangan Pemuat | — | 3.3 V |
| Package Type | — | 357-PBGA (25 x 25 mm) |
| Package Pin Count | — | 357 pins |
| Packaging | — | Tray |
| Status RoHS | — | RoHS |
| Lead-Free Status | — | Contains Lead |
| Output Current | — | [DATA_NEEDED: processor output current specification] |
| Internal Memory | — | [DATA_NEEDED: internal memory configuration] |
| External Memory Interface | — | [DATA_NEEDED: external memory interface details] |
| Communications Peripherals | — | [DATA_NEEDED: communications peripheral list] |
| Maximum Power Dissipation | — | [DATA_NEEDED: maximum power dissipation] |
| Tahanan Panas | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |
| Arus Pemuat | — | [DATA_NEEDED: operating supply current] |