MPC880ZP80 vs MPC880ZP66 Vergleich
Detaillierter Direktvergleich von MPC880ZP80 von NXP Semiconductors und MPC880ZP66 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC880ZP80 | MPC880ZP66 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Core Architecture | PowerPC (MPC8xx family) | — |
| Datenbusbreite | 32-bit | — |
| Maximum Core Frequency | 80 MHz | — |
| Number of Cores | 1 | — |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| Ethernet MACs | 2 (10/100 Mbps Fast Ethernet Controller) | — |
| USB Interface | USB 1.1 (host + slave) | — |
| Serial Communications Controllers (SCC) | 2 (per datasheet family) | — |
| Serial Management Controllers (SMC) | 2 (per datasheet family) | — |
| PCMCIA Controller | Yes (2 ports) | — |
| Memory Controller | DRAM/Flash/SRAM, 32-bit | — |
| Operating Voltage - Core | [DATA_NEEDED: core voltage] | — |
| Operating Voltage - I/O | 3.3 V | — |
| Gehäuse | 357-PBGA (25x25 mm) | — |
| Montageart | Surface Mount | Surface mount |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | 0 C to 95 C |
| Process Technology | CMOS | — |
| Lead Free / RoHS | [DATA_NEEDED: RoHS status] | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Lifecycle | Obsolete (Rochester Electronics stocking) | — |
| Processor Type | — | MPC8xx PowerQUICC communications microprocessor |
| Architecture | — | Power Architecture |
| Core Count | — | 1 core |
| Data Width | — | 32 bit |
| Maximale Taktfrequenz | — | 66 MHz |
| Versorgungsspannung | — | 3.3 V |
| Package Type | — | 357-PBGA (25 x 25 mm) |
| Package Pin Count | — | 357 pins |
| Packaging | — | Tray |
| RoHS-Status | — | RoHS |
| Lead-Free Status | — | Contains Lead |
| Output Current | — | [DATA_NEEDED: processor output current specification] |
| Internal Memory | — | [DATA_NEEDED: internal memory configuration] |
| External Memory Interface | — | [DATA_NEEDED: external memory interface details] |
| Communications Peripherals | — | [DATA_NEEDED: communications peripheral list] |
| Maximum Power Dissipation | — | [DATA_NEEDED: maximum power dissipation] |
| Wärmewiderstand | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |
| Versorgungsstrom | — | [DATA_NEEDED: operating supply current] |