MPX5700DP vs MPX5500DP Comparison
Detailed side-by-side comparison of MPX5700DP by NXP Semiconductors and MPX5500DP by STMicroelectronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
STMicroelectronics
MPX5500DP - 500kPa Differential Pressure Sensor | STMicroelectronics
MPX5500DP ✓ ActiveSpecification Comparison
| Parameter | MPX5700DP | MPX5500DP |
|---|---|---|
| Brand | NXP Semiconductors | STMicroelectronics |
| Category | Pressure Sensors | Pressure Sensors |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $9.20 | $4.86 |
| Pressure Type | Differential | Differential (Dual Port) |
| Operating Pressure Range | 0 kPa to 700 kPa (0 psi to 101.5 psi) | — |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | — |
| Output Type | Analog voltage, ratiometric | Analog Voltage |
| Output Voltage Range | 0.2 V to 4.7 V | 0.2 V to 4.7 V |
| Full-Scale Span (VFSS) | 4.5 V (typical) | — |
| Supply Voltage | 4.75 V to 5.25 V (5 V typical) | 5 V (typical) |
| Supply Current | [DATA_NEEDED: supply current] | [DATA_NEEDED: supply current] |
| Accuracy | ±2.5% VFSS (0°C to 85°C) | [DATA_NEEDED: accuracy %FS] |
| Operating Temperature | -40°C to +125°C | -40C to +125C (per ST datasheet family) |
| Response Time | 1 ms (typical) | — |
| Port Style | Dual Male 0.19" (4.93 mm) Tube, Horizontal | — |
| Package / Case | 6-SIP Module (Case 867C-05) | — |
| Mounting Type | Through-hole, vertical SIP | Through-Hole (SIP) |
| Technology | Piezoresistive MEMS, bipolar signal conditioning | Piezoresistive, Monolithic Silicon |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant (per ST/NXP product pages) |
| Operating Pressure Max | — | 500 kPa (72.52 PSI) |
| Operating Pressure Min | — | 0 kPa |
| Compensated Temperature | — | 0 C to 85 C |
| Port Size | — | Male 0.19" (4.93 mm) Tube, Dual |
| Package | — | 6-SIP Module |
| Package Dimensions | — | 17.78 mm x 29.48 mm x 10.67 mm |
| Lead Pitch | — | 2.54 mm |
| Signal Conditioning | — | On-chip, Temperature Compensated |