MPX5700DP vs MPX5500DP Vergleich
Detaillierter Direktvergleich von MPX5700DP von NXP Semiconductors und MPX5500DP von STMicroelectronics. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
STMicroelectronics
MPX5500DP - 500kPa Differential Pressure Sensor | STMicroelectronics
MPX5500DP ✓ AktivSpezifikationsvergleich
| Parameter | MPX5700DP | MPX5500DP |
|---|---|---|
| Marke | NXP Semiconductors | STMicroelectronics |
| Kategorie | Pressure Sensors | Pressure Sensors |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,20 | $4,86 |
| Pressure Type | Differential | Differential (Dual Port) |
| Operating Pressure Range | 0 kPa to 700 kPa (0 psi to 101.5 psi) | — |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | — |
| Ausgangstyp | Analog voltage, ratiometric | Analog Voltage |
| Ausgangsspannungsbereich | 0.2 V to 4.7 V | 0.2 V to 4.7 V |
| Full-Scale Span (VFSS) | 4.5 V (typical) | — |
| Versorgungsspannung | 4.75 V to 5.25 V (5 V typical) | 5 V (typical) |
| Versorgungsstrom | [DATA_NEEDED: supply current] | [DATA_NEEDED: supply current] |
| Accuracy | ±2.5% VFSS (0°C to 85°C) | [DATA_NEEDED: accuracy %FS] |
| Betriebstemperatur | -40°C to +125°C | -40C to +125C (per ST datasheet family) |
| Response Time | 1 ms (typical) | — |
| Port Style | Dual Male 0.19" (4.93 mm) Tube, Horizontal | — |
| Gehäuse / Bauform | 6-SIP Module (Case 867C-05) | — |
| Montageart | Through-hole, vertical SIP | Through-Hole (SIP) |
| Technology | Piezoresistive MEMS, bipolar signal conditioning | Piezoresistive, Monolithic Silicon |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant (per ST/NXP product pages) |
| Operating Pressure Max | — | 500 kPa (72.52 PSI) |
| Operating Pressure Min | — | 0 kPa |
| Compensated Temperature | — | 0 C to 85 C |
| Port Size | — | Male 0.19" (4.93 mm) Tube, Dual |
| Gehäuse | — | 6-SIP Module |
| Package Dimensions | — | 17.78 mm x 29.48 mm x 10.67 mm |
| Lead Pitch | — | 2.54 mm |
| Signal Conditioning | — | On-chip, Temperature Compensated |