MPX5700DP vs MPX5500DP Perbandingan
Perbandingan bersamaan detil MPX5700DP dari NXP Semiconductors dan MPX5500DP dari STMicroelectronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
STMicroelectronics
MPX5500DP - 500kPa Differential Pressure Sensor | STMicroelectronics
MPX5500DP ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | MPX5700DP | MPX5500DP |
|---|---|---|
| Merek | NXP Semiconductors | STMicroelectronics |
| Kategori | Pressure Sensors | Pressure Sensors |
| Status Lingkungan Hidup | Aktif | Aktif |
| Pressure Type | Differential | Differential (Dual Port) |
| Operating Pressure Range | 0 kPa to 700 kPa (0 psi to 101.5 psi) | — |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | — |
| Tipe Output | Analog voltage, ratiometric | Analog Voltage |
| Rentang Tegangan Output | 0.2 V to 4.7 V | 0.2 V to 4.7 V |
| Full-Scale Span (VFSS) | 4.5 V (typical) | — |
| Tegangan Pemuat | 4.75 V to 5.25 V (5 V typical) | 5 V (typical) |
| Arus Pemuat | [DATA_NEEDED: supply current] | [DATA_NEEDED: supply current] |
| Accuracy | ±2.5% VFSS (0°C to 85°C) | [DATA_NEEDED: accuracy %FS] |
| Suhu Kerja | -40°C to +125°C | -40C to +125C (per ST datasheet family) |
| Response Time | 1 ms (typical) | — |
| Port Style | Dual Male 0.19" (4.93 mm) Tube, Horizontal | — |
| Paket / Case | 6-SIP Module (Case 867C-05) | — |
| Tipe Mounting | Through-hole, vertical SIP | Through-Hole (SIP) |
| Technology | Piezoresistive MEMS, bipolar signal conditioning | Piezoresistive, Monolithic Silicon |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant (per ST/NXP product pages) |
| Operating Pressure Max | — | 500 kPa (72.52 PSI) |
| Operating Pressure Min | — | 0 kPa |
| Compensated Temperature | — | 0 C to 85 C |
| Port Size | — | Male 0.19" (4.93 mm) Tube, Dual |
| Paket | — | 6-SIP Module |
| Package Dimensions | — | 17.78 mm x 29.48 mm x 10.67 mm |
| Lead Pitch | — | 2.54 mm |
| Signal Conditioning | — | On-chip, Temperature Compensated |