MPXC2012DT1 vs MPXC2011DT1 Comparison
Detailed side-by-side comparison of MPXC2012DT1 by NXP Semiconductors and MPXC2011DT1 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP
MPXC2011DT1 ✓ ActiveSpecification Comparison
| Parameter | MPXC2012DT1 | MPXC2011DT1 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Pressure Sensors | Pressure Sensors |
| Lifecycle Status | NRND | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $7.40 | $14.95 |
| Pressure Type | Differential | Differential |
| Operating Pressure | 1.45 PSI (10 kPa) | — |
| Maximum Over Pressure | [DATA_NEEDED: maximum overpressure rating] | — |
| Output Type | Wheatstone Bridge (analog mV) | Analog Wheatstone bridge (ratiometric) |
| Full-Scale Output | 24 mV to 26 mV (typ. 25 mV) at 10 V excitation | 25 mV typical at 10 V excitation |
| Offset (Null) | 0 mV nominal at 10 V excitation | — |
| Excitation Voltage | 10 V DC typical | 3 V DC to 10 V DC (10 V nominal) |
| Bridge Resistance | [DATA_NEEDED: input/output bridge resistance] | — |
| Linearity | [DATA_NEEDED: linearity %FS] | — |
| Pressure Port Size | Female, 0.128 in (3.25 mm) side port | — |
| Port Style | Side port, single barbed inlet | Female, 3.25 mm (0.128 in) barbed side port |
| Package / Case | 4-SSIP Module (chip-pak, no gel) | — |
| Termination Style | Through-hole PCB (vertical mount) | Through-hole PCB, 4 leads |
| Gel Protection | No (bare die in chip-pak cavity) | — |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | 0 °C to +85 °C |
| Storage Temperature | [DATA_NEEDED: storage temperature range] | — |
| Mounting Type | Through-hole, vertical | Through-hole (PCB mount with side-port tubing) |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status not in web data] |
| MSL Level | Not applicable (through-hole sensor module) | — |
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola) | — |
| Operating Pressure Range | — | 0 kPa to 10 kPa (0 PSI to 1.45 PSI) |
| Sensitivity | — | 2.5 mV/kPa typical |
| Package | — | 4-SSIP Chip Pak module, side port |
| Compensation | — | On-chip temperature compensated and calibrated |
| Technology | — | Piezoresistive silicon strain gauge |
| Module Dimensions | — | 7.6 mm x 12.8 mm nominal |