MPXC2012DT1 vs MPXC2011DT1 Comparaison

Comparaison détaillée côte à côte de MPXC2012DT1 par NXP Semiconductors et MPXC2011DT1 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

NXP Semiconductors
MPXC2011DT1 MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP

MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP

MPXC2011DT1 ✓ Actif

Comparaison des spécifications

Paramètre MPXC2012DT1 MPXC2011DT1
Marque NXP Semiconductors NXP Semiconductors
Catégorie Pressure Sensors Pressure Sensors
Statut du cycle de vie NRND Actif
Statut du stock In Stock In Stock
Prix unitaire (USD) $7,40 $14,95
Pressure Type Differential Differential
Operating Pressure 1.45 PSI (10 kPa) —
Maximum Over Pressure [DATA_NEEDED: maximum overpressure rating] —
Type de sortie Wheatstone Bridge (analog mV) Analog Wheatstone bridge (ratiometric)
Full-Scale Output 24 mV to 26 mV (typ. 25 mV) at 10 V excitation 25 mV typical at 10 V excitation
Offset (Null) 0 mV nominal at 10 V excitation —
Excitation Voltage 10 V DC typical 3 V DC to 10 V DC (10 V nominal)
Bridge Resistance [DATA_NEEDED: input/output bridge resistance] —
Linearity [DATA_NEEDED: linearity %FS] —
Pressure Port Size Female, 0.128 in (3.25 mm) side port —
Port Style Side port, single barbed inlet Female, 3.25 mm (0.128 in) barbed side port
Boîtier / Format 4-SSIP Module (chip-pak, no gel) —
Termination Style Through-hole PCB (vertical mount) Through-hole PCB, 4 leads
Gel Protection No (bare die in chip-pak cavity) —
Température de fonctionnement [DATA_NEEDED: operating temperature range] 0 °C to +85 °C
Storage Temperature [DATA_NEEDED: storage temperature range] —
Type de montage Through-hole, vertical Through-hole (PCB mount with side-port tubing)
Statut RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status not in web data]
Niveau MSL Not applicable (through-hole sensor module) —
Manufacturer NXP Semiconductors (formerly Freescale / Motorola) —
Operating Pressure Range — 0 kPa to 10 kPa (0 PSI to 1.45 PSI)
Sensitivity — 2.5 mV/kPa typical
Boîtier — 4-SSIP Chip Pak module, side port
Compensation — On-chip temperature compensated and calibrated
Technology — Piezoresistive silicon strain gauge
Module Dimensions — 7.6 mm x 12.8 mm nominal

Fiches techniques et ressources

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