MPXC2012DT1 vs MPXC2011DT1 Comparação

Comparação detalhada lado a lado de MPXC2012DT1 por NXP Semiconductors e MPXC2011DT1 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPXC2011DT1 MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP

MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP

MPXC2011DT1 ✓ Ativo

Comparação de especificações

Parâmetro MPXC2012DT1 MPXC2011DT1
Marca NXP Semiconductors NXP Semiconductors
Categoria Pressure Sensors Pressure Sensors
Status do ciclo de vida NRND Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $7,40 $14,95
Pressure Type Differential Differential
Operating Pressure 1.45 PSI (10 kPa) —
Maximum Over Pressure [DATA_NEEDED: maximum overpressure rating] —
Tipo de saída Wheatstone Bridge (analog mV) Analog Wheatstone bridge (ratiometric)
Full-Scale Output 24 mV to 26 mV (typ. 25 mV) at 10 V excitation 25 mV typical at 10 V excitation
Offset (Null) 0 mV nominal at 10 V excitation —
Excitation Voltage 10 V DC typical 3 V DC to 10 V DC (10 V nominal)
Bridge Resistance [DATA_NEEDED: input/output bridge resistance] —
Linearity [DATA_NEEDED: linearity %FS] —
Pressure Port Size Female, 0.128 in (3.25 mm) side port —
Port Style Side port, single barbed inlet Female, 3.25 mm (0.128 in) barbed side port
Encapsulamento / Caixa 4-SSIP Module (chip-pak, no gel) —
Termination Style Through-hole PCB (vertical mount) Through-hole PCB, 4 leads
Gel Protection No (bare die in chip-pak cavity) —
Temperatura de operação [DATA_NEEDED: operating temperature range] 0 °C to +85 °C
Storage Temperature [DATA_NEEDED: storage temperature range] —
Tipo de montagem Through-hole, vertical Through-hole (PCB mount with side-port tubing)
Status RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status not in web data]
Nível MSL Not applicable (through-hole sensor module) —
Manufacturer NXP Semiconductors (formerly Freescale / Motorola) —
Operating Pressure Range — 0 kPa to 10 kPa (0 PSI to 1.45 PSI)
Sensitivity — 2.5 mV/kPa typical
Encapsulamento — 4-SSIP Chip Pak module, side port
Compensation — On-chip temperature compensated and calibrated
Technology — Piezoresistive silicon strain gauge
Module Dimensions — 7.6 mm x 12.8 mm nominal

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