MPXV2010GP vs MPX2010DP Comparison
Detailed side-by-side comparison of MPXV2010GP by STMicroelectronics and MPX2010DP by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
STMicroelectronics
MPXV2010GP - 10kPa Vented Gauge Pressure Sensor | STMicroelectronics
MPXV2010GP ✓ Active
Specification Comparison
| Parameter | MPXV2010GP | MPX2010DP |
|---|---|---|
| Brand | STMicroelectronics | NXP Semiconductors |
| Category | Pressure Sensors | Pressure Sensors |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $8.62 | $8.50 |
| Pressure Type | Vented Gauge | — |
| Operating Pressure Range | 0 kPa to 10 kPa | — |
| Maximum Overload Pressure | 75 kPa | — |
| Supply Voltage (Vex) | 10 V typical (max 16 V) | — |
| Full-Scale Output (Span) at 10 V | 25 mV nominal at 10 kPa | — |
| Zero Pressure Output (Offset) | 0 mV to 1.0 mV | — |
| Pressure Hysteresis | 1.0 kPa (typical) | — |
| Sensitivity | 2.5 mV/kPa nominal at 10 V | — |
| Response Time | 1.0 ms (typical) | 1.0 ms (typical) |
| Output Type | Analog, ratiometric, mV output | Analog voltage, Wheatstone bridge (mV level) |
| Operating Temperature | -40 C to +125 C | -40 °C to +125 °C |
| Port Configuration | Single vertical side port, 0.13" (3.17 mm) tube | Dual ports (differential), 0.19 inch / 4.93 mm tubes |
| Package | 8-SMD, Gull Wing, Side Port (Case 344B-01) | — |
| Mounting Type | Surface Mount | — |
| Technology | Silicon piezoresistive MEMS, on-chip temp compensated | Piezoresistive (silicon strain gauge bridge) |
| RoHS Status | Compliant | Compliant |
| Sensor Type | — | Differential Pressure Sensor |
| Pressure Range | — | 0 to 10 kPa (0 to 1.45 PSI) |
| Typical Full-Scale Span | — | 25 mV at 10 V excitation |
| Zero Pressure Offset | — | 0 mV nominally (±1.0 mV max) |
| Supply Voltage | — | 10 V DC typical (max 16 V) |
| Linearity | — | ±0.05% (typ) |
| Temperature Compensation | — | 0 °C to +85 °C (on-chip) |
| Maximum Overpressure | — | 75 kPa |
| Burst Pressure | — | 200 kPa |
| Package / Mounting | — | 4-SIP Module (through-hole with axial tubes) |
| Media Compatibility | — | Dry air or non-corrosive gas |