MRF7S21150HSR3 vs MW4IC2230MBR5 Comparison
Detailed side-by-side comparison of MRF7S21150HSR3 by NXP Semiconductors and MW4IC2230MBR5 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MRF7S21150HSR3 - 28V 44W RF Power LDMOS, 2110-2170 MHz | NXP
MRF7S21150HSR3 ObsoleteSpecification Comparison
| Parameter | MRF7S21150HSR3 | MW4IC2230MBR5 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | MOSFETs | RF Amplifiers |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $62.80 | $29.85 |
| Transistor Type | N-Channel LDMOS RF Power MOSFET | — |
| Frequency Band | 2110 MHz to 2170 MHz | — |
| Test Voltage | 28 V | — |
| Rated Drain Voltage (Vds max) | 65 V | — |
| Average Output Power | 44 W (W-CDMA) | — |
| Peak Output Power | 150 W | — |
| Power Gain | 17.5 dB (typical at 2.14 GHz) | 31 dB (typical) |
| Test Current | 1.35 A | — |
| Package | NI-780S (NI-780 HS variant) | — |
| Configuration | Single, push-pull final stage | — |
| Mounting Type | Flange / bolt-down with ceramic body | Surface Mount (with heatsink) |
| Lead Configuration | High-source-leads (HS) variant | — |
| Operating Mode | Class AB / Doherty | Class AB (typical) |
| Application | W-CDMA, LTE base station final-stage PA | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: rohs status] |
| JEDEC Qualification | JESD22 thermal/mechanical | — |
| MSL Level | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Part Type | — | RF LDMOS Wideband Integrated Power Amplifier |
| Frequency Range | — | 1.6 GHz to 2.4 GHz |
| Output Power (Pout) | — | 30 W (CW) |
| Supply Voltage (Vdd) | — | 26 V nominal |
| Quiescent Current (Idq) | — | 60 mA |
| Technology | — | LDMOS (Laterally Diffused MOSFET) |
| Package / Case | — | TO-272 WB-16 Variant, Flat Leads (over-molded plastic) |
| Supported Air Interfaces | — | Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA |
| Input Matching | — | Internal wideband matching network |
| Lead Finish | — | [DATA_NEEDED: lead finish] |