MSC8151TAG1000B vs MSC8156HAG1000B Comparison

Detailed side-by-side comparison of MSC8151TAG1000B by NXP Semiconductors and MSC8156HAG1000B by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MSC8151TAG1000B MSC8151TAG1000B - SC3850 1GHz DSP, 783-FCPBGA | NXP Semiconductors

MSC8151TAG1000B - SC3850 1GHz DSP, 783-FCPBGA | NXP Semiconductors

MSC8151TAG1000B Obsolete
NXP Semiconductors
MSC8156HAG1000B MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP

MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP

MSC8156HAG1000B ✓ Active

Specification Comparison

Parameter MSC8151TAG1000B MSC8156HAG1000B
Brand NXP Semiconductors NXP Semiconductors
Category DSP DSP
Lifecycle Status Obsolete Active
Stock Status In Stock In Stock
Unit Price (USD) $124.00 $198.75
Part Number MSC8151TAG1000B —
Manufacturer NXP Semiconductors —
Series StarCore —
Product Type SC3850 Single-Core Digital Signal Processor (DSP) Multi-core Digital Signal Processor (DSP)
Core Architecture StarCore SC3850 (1 core) —
Clock Rate 1 GHz —
L1 Instruction Cache 32 kB —
L1 Data Cache 32 kB —
L2 Unified Cache 512 kB (M2 in 64 kB increments) —
On-Chip RAM (total) 576 kB —
ROM 96 kB —
Memory Management MMU + EPIC (Extended Programmable Interrupt Controller) —
Hardware Accelerator MAPLE-B (Turbo/Viterbi FEC) MAPLE-B (turbo/Viterbi FEC)
Core Voltage 1.00 V —
I/O Voltage 2.50 V —
Package 783-FCBGA (FC-PBGA, 29x29 mm) 783-ball FCBGA (FCP-BGA), 29 x 29 mm
Operating Interfaces Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART —
Timers Two general-purpose 32-bit —
Power States Wait, Stop, Debug modes —
Operating Temperature [DATA_NEEDED: operating temperature range] 0C to +105C
Mounting Type Surface Mount (BGA) Surface Mount
Part Status Obsolete —
DSP Cores — 6 x StarCore SC3850
Core Clock Frequency — 1 GHz per core
On-chip RAM — 576 KB (L1/L2 SRAM)
On-chip ROM — 96 KB
External Memory Interface — DDR2/DDR3 with ECC
High-speed Serial Fabric — 2 x Serial RapidIO (SRIO), 2 x PCIe Gen1/Gen2
Ethernet — 2 x Gigabit Ethernet (SGMII/RGMII)
Queuing Engine — Yes (QE for packet/traffic management)
Peripheral Interfaces — SPI, I2C, UART, PCI
Process Technology — CMOS
Peak Reflow Temperature — 245C (JEDEC J-STD-020)
Terminal Finish — Tin Silver Copper (e1 per JESD-609)
MSL Level — [DATA_NEEDED: MSL rating]
RoHS Status — Compliant (per distributor datasheet listing)

Datasheets & Resources

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