MSC8151TAG1000B vs MSC8156HAG1000B Vergleich
Detaillierter Direktvergleich von MSC8151TAG1000B von NXP Semiconductors und MSC8156HAG1000B von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MSC8151TAG1000B - SC3850 1GHz DSP, 783-FCPBGA | NXP Semiconductors
MSC8151TAG1000B ObsoleteSpezifikationsvergleich
| Parameter | MSC8151TAG1000B | MSC8156HAG1000B |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | DSP | DSP |
| Lebenszyklusstatus | Obsolete | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $124,00 | $198,75 |
| Part Number | MSC8151TAG1000B | — |
| Manufacturer | NXP Semiconductors | — |
| Series | StarCore | — |
| Product Type | SC3850 Single-Core Digital Signal Processor (DSP) | Multi-core Digital Signal Processor (DSP) |
| Core Architecture | StarCore SC3850 (1 core) | — |
| Clock Rate | 1 GHz | — |
| L1 Instruction Cache | 32 kB | — |
| L1 Data Cache | 32 kB | — |
| L2 Unified Cache | 512 kB (M2 in 64 kB increments) | — |
| On-Chip RAM (total) | 576 kB | — |
| ROM | 96 kB | — |
| Memory Management | MMU + EPIC (Extended Programmable Interrupt Controller) | — |
| Hardware Accelerator | MAPLE-B (Turbo/Viterbi FEC) | MAPLE-B (turbo/Viterbi FEC) |
| Core Voltage | 1.00 V | — |
| I/O Voltage | 2.50 V | — |
| Gehäuse | 783-FCBGA (FC-PBGA, 29x29 mm) | 783-ball FCBGA (FCP-BGA), 29 x 29 mm |
| Operating Interfaces | Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART | — |
| Timers | Two general-purpose 32-bit | — |
| Power States | Wait, Stop, Debug modes | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | 0C to +105C |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Part Status | Obsolete | — |
| DSP Cores | — | 6 x StarCore SC3850 |
| Core Clock Frequency | — | 1 GHz per core |
| On-chip RAM | — | 576 KB (L1/L2 SRAM) |
| On-chip ROM | — | 96 KB |
| External Memory Interface | — | DDR2/DDR3 with ECC |
| High-speed Serial Fabric | — | 2 x Serial RapidIO (SRIO), 2 x PCIe Gen1/Gen2 |
| Ethernet | — | 2 x Gigabit Ethernet (SGMII/RGMII) |
| Queuing Engine | — | Yes (QE for packet/traffic management) |
| Peripheral Interfaces | — | SPI, I2C, UART, PCI |
| Process Technology | — | CMOS |
| Peak Reflow Temperature | — | 245C (JEDEC J-STD-020) |
| Terminal Finish | — | Tin Silver Copper (e1 per JESD-609) |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| RoHS-Status | — | Compliant (per distributor datasheet listing) |