MSC8151TAG1000B vs MSC8156HAG1000B Comparaison

Comparaison détaillée côte à côte de MSC8151TAG1000B par NXP Semiconductors et MSC8156HAG1000B par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

NXP Semiconductors
MSC8151TAG1000B MSC8151TAG1000B - SC3850 1GHz DSP, 783-FCPBGA | NXP Semiconductors

MSC8151TAG1000B - SC3850 1GHz DSP, 783-FCPBGA | NXP Semiconductors

MSC8151TAG1000B Obsolete
NXP Semiconductors
MSC8156HAG1000B MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP

MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP

MSC8156HAG1000B ✓ Actif

Comparaison des spécifications

Paramètre MSC8151TAG1000B MSC8156HAG1000B
Marque NXP Semiconductors NXP Semiconductors
Catégorie DSP DSP
Statut du cycle de vie Obsolete Actif
Statut du stock In Stock In Stock
Prix unitaire (USD) $124,00 $198,75
Part Number MSC8151TAG1000B —
Manufacturer NXP Semiconductors —
Series StarCore —
Product Type SC3850 Single-Core Digital Signal Processor (DSP) Multi-core Digital Signal Processor (DSP)
Core Architecture StarCore SC3850 (1 core) —
Clock Rate 1 GHz —
L1 Instruction Cache 32 kB —
L1 Data Cache 32 kB —
L2 Unified Cache 512 kB (M2 in 64 kB increments) —
On-Chip RAM (total) 576 kB —
ROM 96 kB —
Memory Management MMU + EPIC (Extended Programmable Interrupt Controller) —
Hardware Accelerator MAPLE-B (Turbo/Viterbi FEC) MAPLE-B (turbo/Viterbi FEC)
Core Voltage 1.00 V —
I/O Voltage 2.50 V —
Boîtier 783-FCBGA (FC-PBGA, 29x29 mm) 783-ball FCBGA (FCP-BGA), 29 x 29 mm
Operating Interfaces Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART —
Timers Two general-purpose 32-bit —
Power States Wait, Stop, Debug modes —
Température de fonctionnement [DATA_NEEDED: operating temperature range] 0C to +105C
Type de montage Surface Mount (BGA) Surface Mount
Part Status Obsolete —
DSP Cores — 6 x StarCore SC3850
Core Clock Frequency — 1 GHz per core
On-chip RAM — 576 KB (L1/L2 SRAM)
On-chip ROM — 96 KB
External Memory Interface — DDR2/DDR3 with ECC
High-speed Serial Fabric — 2 x Serial RapidIO (SRIO), 2 x PCIe Gen1/Gen2
Ethernet — 2 x Gigabit Ethernet (SGMII/RGMII)
Queuing Engine — Yes (QE for packet/traffic management)
Peripheral Interfaces — SPI, I2C, UART, PCI
Process Technology — CMOS
Peak Reflow Temperature — 245C (JEDEC J-STD-020)
Terminal Finish — Tin Silver Copper (e1 per JESD-609)
Niveau MSL — [DATA_NEEDED: MSL rating]
Statut RoHS — Compliant (per distributor datasheet listing)

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