MSC8151TAG1000B vs MSC8156HAG1000B Comparação
Comparação detalhada lado a lado de MSC8151TAG1000B por NXP Semiconductors e MSC8156HAG1000B por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MSC8151TAG1000B - SC3850 1GHz DSP, 783-FCPBGA | NXP Semiconductors
MSC8151TAG1000B ObsoleteComparação de especificações
| Parâmetro | MSC8151TAG1000B | MSC8156HAG1000B |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | DSP | DSP |
| Status do ciclo de vida | Obsolete | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $124,00 | $198,75 |
| Part Number | MSC8151TAG1000B | — |
| Manufacturer | NXP Semiconductors | — |
| Series | StarCore | — |
| Product Type | SC3850 Single-Core Digital Signal Processor (DSP) | Multi-core Digital Signal Processor (DSP) |
| Core Architecture | StarCore SC3850 (1 core) | — |
| Clock Rate | 1 GHz | — |
| L1 Instruction Cache | 32 kB | — |
| L1 Data Cache | 32 kB | — |
| L2 Unified Cache | 512 kB (M2 in 64 kB increments) | — |
| On-Chip RAM (total) | 576 kB | — |
| ROM | 96 kB | — |
| Memory Management | MMU + EPIC (Extended Programmable Interrupt Controller) | — |
| Hardware Accelerator | MAPLE-B (Turbo/Viterbi FEC) | MAPLE-B (turbo/Viterbi FEC) |
| Core Voltage | 1.00 V | — |
| I/O Voltage | 2.50 V | — |
| Encapsulamento | 783-FCBGA (FC-PBGA, 29x29 mm) | 783-ball FCBGA (FCP-BGA), 29 x 29 mm |
| Operating Interfaces | Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART | — |
| Timers | Two general-purpose 32-bit | — |
| Power States | Wait, Stop, Debug modes | — |
| Temperatura de operação | [DATA_NEEDED: operating temperature range] | 0C to +105C |
| Tipo de montagem | Surface Mount (BGA) | Surface Mount |
| Part Status | Obsolete | — |
| DSP Cores | — | 6 x StarCore SC3850 |
| Core Clock Frequency | — | 1 GHz per core |
| On-chip RAM | — | 576 KB (L1/L2 SRAM) |
| On-chip ROM | — | 96 KB |
| External Memory Interface | — | DDR2/DDR3 with ECC |
| High-speed Serial Fabric | — | 2 x Serial RapidIO (SRIO), 2 x PCIe Gen1/Gen2 |
| Ethernet | — | 2 x Gigabit Ethernet (SGMII/RGMII) |
| Queuing Engine | — | Yes (QE for packet/traffic management) |
| Peripheral Interfaces | — | SPI, I2C, UART, PCI |
| Process Technology | — | CMOS |
| Peak Reflow Temperature | — | 245C (JEDEC J-STD-020) |
| Terminal Finish | — | Tin Silver Copper (e1 per JESD-609) |
| Nível MSL | — | [DATA_NEEDED: MSL rating] |
| Status RoHS | — | Compliant (per distributor datasheet listing) |