MSC8157ETAG1000A vs MSC8157SVT1000A Comparison

Detailed side-by-side comparison of MSC8157ETAG1000A by NXP Semiconductors and MSC8157SVT1000A by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MSC8157ETAG1000A MSC8157ETAG1000A - SC3850 Six-Core DSP 1GHz | NXP Semiconductors

MSC8157ETAG1000A - SC3850 Six-Core DSP 1GHz | NXP Semiconductors

MSC8157ETAG1000A Nrnd
NXP Semiconductors
MSC8157SVT1000A MSC8157SVT1000A - 6x SC3850 DSP SoC, 1GHz, FCBGA-783 | NXP

MSC8157SVT1000A - 6x SC3850 DSP SoC, 1GHz, FCBGA-783 | NXP

MSC8157SVT1000A Obsolete

Specification Comparison

Parameter MSC8157ETAG1000A MSC8157SVT1000A
Brand NXP Semiconductors NXP Semiconductors
Category DSP DSP
Lifecycle Status NRND Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $224.50 $198.40
Manufacturer NXP Semiconductors (formerly Freescale) —
Series StarCore MSC815x —
Core Architecture SC3850 (six-core) —
Number of Cores 6 —
Core Clock Frequency 1 GHz —
Aggregate Throughput >24 GMACS (16-bit fixed point) —
Per-Core MMACS 4000 MMACS @ 16-bit, 2000 MMACS @ 32-bit —
Accelerator Engine MAPLE-B baseband coprocessor (Turbo/Viterbi) —
Memory Controllers Dual DDR2/DDR3 with ECC —
High-Speed I/O 4x Serial RapidIO, 2x GbE SGMII, PCIe Gen 2 —
Package 783-FCBGA (29x29 mm) —
Mounting Type Surface Mount (BGA) Surface Mount
Operating Temperature -40C to +105C -40C to +105C
Supply Voltages 1.0 V core, 1.5 V DDR, 3.3 V I/O —
MSL Level 4 (per JEDEC J-STD-020 for large FCBGA) [DATA_NEEDED: MSL rating]
RoHS Status Compliant Compliant
Lead-Free Yes —
Process Node [DATA_NEEDED: process node] —
Product Type — Multi-core Digital Signal Processor (DSP SoC)
Architecture — StarCore SC3850, six cores
Data Bus Width — 64-bit
Maximum Clock Speed — 1 GHz
Performance — 1000 MIPS per core, up to 6000 MIPS aggregate
L1 Instruction Cache (per core) — 32 KB
L1 Data Cache (per core) — 32 KB
L2 Cache (unified) — Shared KB-scale unified L2
Supply Voltage — 1 V (core) + I/O rails
Package Type — FCBGA-783 (Flip-Chip BGA)
Package Size — 29 mm x 29 mm
Pin Count — 783
Lead Free — Yes
Memory Interface — External DDR2/DDR3 SDRAM controller
Serial Interfaces — SerDes, Ethernet MAC, I2C, UART

Datasheets & Resources

Browse All Products Create BOM Request Quote