MSC8157ETAG1000A vs MSC8157SVT1000A Vergleich
Detaillierter Direktvergleich von MSC8157ETAG1000A von NXP Semiconductors und MSC8157SVT1000A von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MSC8157ETAG1000A - SC3850 Six-Core DSP 1GHz | NXP Semiconductors
MSC8157ETAG1000A NrndNXP Semiconductors
MSC8157SVT1000A - 6x SC3850 DSP SoC, 1GHz, FCBGA-783 | NXP
MSC8157SVT1000A ObsoleteSpezifikationsvergleich
| Parameter | MSC8157ETAG1000A | MSC8157SVT1000A |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | DSP | DSP |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $224,50 | $198,40 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | StarCore MSC815x | — |
| Core Architecture | SC3850 (six-core) | — |
| Number of Cores | 6 | — |
| Core Clock Frequency | 1 GHz | — |
| Aggregate Throughput | >24 GMACS (16-bit fixed point) | — |
| Per-Core MMACS | 4000 MMACS @ 16-bit, 2000 MMACS @ 32-bit | — |
| Accelerator Engine | MAPLE-B baseband coprocessor (Turbo/Viterbi) | — |
| Memory Controllers | Dual DDR2/DDR3 with ECC | — |
| High-Speed I/O | 4x Serial RapidIO, 2x GbE SGMII, PCIe Gen 2 | — |
| Gehäuse | 783-FCBGA (29x29 mm) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Betriebstemperatur | -40C to +105C | -40C to +105C |
| Supply Voltages | 1.0 V core, 1.5 V DDR, 3.3 V I/O | — |
| MSL-Level | 4 (per JEDEC J-STD-020 for large FCBGA) | [DATA_NEEDED: MSL rating] |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Process Node | [DATA_NEEDED: process node] | — |
| Product Type | — | Multi-core Digital Signal Processor (DSP SoC) |
| Architecture | — | StarCore SC3850, six cores |
| Datenbusbreite | — | 64-bit |
| Maximum Clock Speed | — | 1 GHz |
| Performance | — | 1000 MIPS per core, up to 6000 MIPS aggregate |
| L1 Instruction Cache (per core) | — | 32 KB |
| L1 Data Cache (per core) | — | 32 KB |
| L2 Cache (unified) | — | Shared KB-scale unified L2 |
| Versorgungsspannung | — | 1 V (core) + I/O rails |
| Package Type | — | FCBGA-783 (Flip-Chip BGA) |
| Package Size | — | 29 mm x 29 mm |
| Pin-Anzahl | — | 783 |
| Lead Free | — | Yes |
| Memory Interface | — | External DDR2/DDR3 SDRAM controller |
| Serial Interfaces | — | SerDes, Ethernet MAC, I2C, UART |