MSC8157ETAG1000A vs MSC8157SVT1000A Comparaison
Comparaison détaillée côte à côte de MSC8157ETAG1000A par NXP Semiconductors et MSC8157SVT1000A par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MSC8157ETAG1000A - SC3850 Six-Core DSP 1GHz | NXP Semiconductors
MSC8157ETAG1000A NrndNXP Semiconductors
MSC8157SVT1000A - 6x SC3850 DSP SoC, 1GHz, FCBGA-783 | NXP
MSC8157SVT1000A ObsoleteComparaison des spécifications
| Paramètre | MSC8157ETAG1000A | MSC8157SVT1000A |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | DSP | DSP |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $224,50 | $198,40 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | StarCore MSC815x | — |
| Core Architecture | SC3850 (six-core) | — |
| Number of Cores | 6 | — |
| Core Clock Frequency | 1 GHz | — |
| Aggregate Throughput | >24 GMACS (16-bit fixed point) | — |
| Per-Core MMACS | 4000 MMACS @ 16-bit, 2000 MMACS @ 32-bit | — |
| Accelerator Engine | MAPLE-B baseband coprocessor (Turbo/Viterbi) | — |
| Memory Controllers | Dual DDR2/DDR3 with ECC | — |
| High-Speed I/O | 4x Serial RapidIO, 2x GbE SGMII, PCIe Gen 2 | — |
| Boîtier | 783-FCBGA (29x29 mm) | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Température de fonctionnement | -40C to +105C | -40C to +105C |
| Supply Voltages | 1.0 V core, 1.5 V DDR, 3.3 V I/O | — |
| Niveau MSL | 4 (per JEDEC J-STD-020 for large FCBGA) | [DATA_NEEDED: MSL rating] |
| Statut RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Process Node | [DATA_NEEDED: process node] | — |
| Product Type | — | Multi-core Digital Signal Processor (DSP SoC) |
| Architecture | — | StarCore SC3850, six cores |
| Largeur du bus de données | — | 64-bit |
| Maximum Clock Speed | — | 1 GHz |
| Performance | — | 1000 MIPS per core, up to 6000 MIPS aggregate |
| L1 Instruction Cache (per core) | — | 32 KB |
| L1 Data Cache (per core) | — | 32 KB |
| L2 Cache (unified) | — | Shared KB-scale unified L2 |
| Tension d'alimentation | — | 1 V (core) + I/O rails |
| Package Type | — | FCBGA-783 (Flip-Chip BGA) |
| Package Size | — | 29 mm x 29 mm |
| Nombre de broches | — | 783 |
| Lead Free | — | Yes |
| Memory Interface | — | External DDR2/DDR3 SDRAM controller |
| Serial Interfaces | — | SerDes, Ethernet MAC, I2C, UART |