MSC8157ETAG1000A vs MSC8157SVT1000A Comparación
Comparación detallada lado a lado de MSC8157ETAG1000A por NXP Semiconductors y MSC8157SVT1000A por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MSC8157ETAG1000A - SC3850 Six-Core DSP 1GHz | NXP Semiconductors
MSC8157ETAG1000A NrndNXP Semiconductors
MSC8157SVT1000A - 6x SC3850 DSP SoC, 1GHz, FCBGA-783 | NXP
MSC8157SVT1000A ObsoleteComparación de especificaciones
| Parámetro | MSC8157ETAG1000A | MSC8157SVT1000A |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | DSP | DSP |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $224,50 | $198,40 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | StarCore MSC815x | — |
| Core Architecture | SC3850 (six-core) | — |
| Number of Cores | 6 | — |
| Core Clock Frequency | 1 GHz | — |
| Aggregate Throughput | >24 GMACS (16-bit fixed point) | — |
| Per-Core MMACS | 4000 MMACS @ 16-bit, 2000 MMACS @ 32-bit | — |
| Accelerator Engine | MAPLE-B baseband coprocessor (Turbo/Viterbi) | — |
| Memory Controllers | Dual DDR2/DDR3 with ECC | — |
| High-Speed I/O | 4x Serial RapidIO, 2x GbE SGMII, PCIe Gen 2 | — |
| Encapsulado | 783-FCBGA (29x29 mm) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Temperatura de funcionamiento | -40C to +105C | -40C to +105C |
| Supply Voltages | 1.0 V core, 1.5 V DDR, 3.3 V I/O | — |
| Nivel MSL | 4 (per JEDEC J-STD-020 for large FCBGA) | [DATA_NEEDED: MSL rating] |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Process Node | [DATA_NEEDED: process node] | — |
| Product Type | — | Multi-core Digital Signal Processor (DSP SoC) |
| Architecture | — | StarCore SC3850, six cores |
| Ancho del bus de datos | — | 64-bit |
| Maximum Clock Speed | — | 1 GHz |
| Performance | — | 1000 MIPS per core, up to 6000 MIPS aggregate |
| L1 Instruction Cache (per core) | — | 32 KB |
| L1 Data Cache (per core) | — | 32 KB |
| L2 Cache (unified) | — | Shared KB-scale unified L2 |
| Tensión de alimentación | — | 1 V (core) + I/O rails |
| Package Type | — | FCBGA-783 (Flip-Chip BGA) |
| Package Size | — | 29 mm x 29 mm |
| Recuento de pines | — | 783 |
| Lead Free | — | Yes |
| Memory Interface | — | External DDR2/DDR3 SDRAM controller |
| Serial Interfaces | — | SerDes, Ethernet MAC, I2C, UART |