MSC8256ESAG1000B vs MSC8251SVT1000B Comparison
Detailed side-by-side comparison of MSC8256ESAG1000B by NXP Semiconductors and MSC8251SVT1000B by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MSC8256ESAG1000B - 6x 1GHz SC3850 StarCore DSP | NXP
MSC8256ESAG1000B ⚠ Last Time BuySpecification Comparison
| Parameter | MSC8256ESAG1000B | MSC8251SVT1000B |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | DSP | DSP |
| Lifecycle Status | Last Time Buy | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $198.75 | $65.00 |
| Core Architecture | StarCore SC3850 VLIW DSP | SC3850 StarCore, single core |
| Number of Cores | 6 | — |
| Core Frequency | 1 GHz | — |
| DDR Memory Interface | DDR2/DDR3 with ECC | — |
| Serial RapidIO | SRIO (peripheral) | Yes (SERDES-based) |
| PCI Express | PCIe (peripheral) | Yes (integrated controller) |
| Gigabit Ethernet | GbE MACs (peripheral) | — |
| Security Engine | SEC (IPsec/SRTP/SSL) | — |
| Queue Engine | QE (peripheral) | — |
| Package | 783-FCPBGA (29x29 mm) | — |
| Mounting Type | Surface Mount, BGA | Surface Mount |
| Operating Temperature | 0°C to 105°C | [DATA_NEEDED: operating temperature grade] |
| MSL Level | 3 | — |
| Peak Reflow Temperature | 245°C (JEDEC J-STD-020) | — |
| Terminal Finish | Tin Silver Copper (e1, JESD-609) | — |
| TDM Links | Up to 4 independent, 62.5 Mbps each | — |
| RoHS Status | Compliant | Compliant |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Core Revision | — | StarCore R2.1 |
| Maximum Core Clock | — | 1 GHz |
| MIPS | — | [DATA_NEEDED: MIPS rating for 1 GHz SC3850] |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| L2 Unified Cache | — | 512 KB (configurable, SRAM or MAP) |
| On-Chip RAM | — | 576 KB |
| Internal ROM | — | 96 KB |
| TDM Interfaces | — | 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support |
| Ethernet MAC | — | Yes (integrated) |
| DMA Controller | — | Multi-channel DMA |
| Package Type | — | FCBGA (Flip-Chip Ball Grid Array) |
| Package Pin Count | — | 783 balls |
| Package Dimensions | — | 29 mm x 29 mm |
| Lead-Free / Halogen-Free | — | Yes (lead-free, halogen-free package) |