MSC8256ESAG1000B vs MSC8251SVT1000B Comparaison
Comparaison détaillée côte à côte de MSC8256ESAG1000B par NXP Semiconductors et MSC8251SVT1000B par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MSC8256ESAG1000B - 6x 1GHz SC3850 StarCore DSP | NXP
MSC8256ESAG1000B ⚠ Dernier achatComparaison des spécifications
| Paramètre | MSC8256ESAG1000B | MSC8251SVT1000B |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | DSP | DSP |
| Statut du cycle de vie | Dernier achat | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $198,75 | $65,00 |
| Core Architecture | StarCore SC3850 VLIW DSP | SC3850 StarCore, single core |
| Number of Cores | 6 | — |
| Core Frequency | 1 GHz | — |
| DDR Memory Interface | DDR2/DDR3 with ECC | — |
| Serial RapidIO | SRIO (peripheral) | Yes (SERDES-based) |
| PCI Express | PCIe (peripheral) | Yes (integrated controller) |
| Gigabit Ethernet | GbE MACs (peripheral) | — |
| Security Engine | SEC (IPsec/SRTP/SSL) | — |
| Queue Engine | QE (peripheral) | — |
| Boîtier | 783-FCPBGA (29x29 mm) | — |
| Type de montage | Surface Mount, BGA | Surface Mount |
| Température de fonctionnement | 0°C to 105°C | [DATA_NEEDED: operating temperature grade] |
| Niveau MSL | 3 | — |
| Peak Reflow Temperature | 245°C (JEDEC J-STD-020) | — |
| Terminal Finish | Tin Silver Copper (e1, JESD-609) | — |
| TDM Links | Up to 4 independent, 62.5 Mbps each | — |
| Statut RoHS | Compliant | Compliant |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Core Revision | — | StarCore R2.1 |
| Maximum Core Clock | — | 1 GHz |
| MIPS | — | [DATA_NEEDED: MIPS rating for 1 GHz SC3850] |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| L2 Unified Cache | — | 512 KB (configurable, SRAM or MAP) |
| On-Chip RAM | — | 576 KB |
| Internal ROM | — | 96 KB |
| TDM Interfaces | — | 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support |
| Ethernet MAC | — | Yes (integrated) |
| DMA Controller | — | Multi-channel DMA |
| Package Type | — | FCBGA (Flip-Chip Ball Grid Array) |
| Package Pin Count | — | 783 balls |
| Package Dimensions | — | 29 mm x 29 mm |
| Lead-Free / Halogen-Free | — | Yes (lead-free, halogen-free package) |