MSC8256ESAG1000B vs MSC8251SVT1000B Comparación
Comparación detallada lado a lado de MSC8256ESAG1000B por NXP Semiconductors y MSC8251SVT1000B por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MSC8256ESAG1000B - 6x 1GHz SC3850 StarCore DSP | NXP
MSC8256ESAG1000B ⚠ Última compraComparación de especificaciones
| Parámetro | MSC8256ESAG1000B | MSC8251SVT1000B |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | DSP | DSP |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $198,75 | $65,00 |
| Core Architecture | StarCore SC3850 VLIW DSP | SC3850 StarCore, single core |
| Number of Cores | 6 | — |
| Core Frequency | 1 GHz | — |
| DDR Memory Interface | DDR2/DDR3 with ECC | — |
| Serial RapidIO | SRIO (peripheral) | Yes (SERDES-based) |
| PCI Express | PCIe (peripheral) | Yes (integrated controller) |
| Gigabit Ethernet | GbE MACs (peripheral) | — |
| Security Engine | SEC (IPsec/SRTP/SSL) | — |
| Queue Engine | QE (peripheral) | — |
| Encapsulado | 783-FCPBGA (29x29 mm) | — |
| Tipo de montaje | Surface Mount, BGA | Surface Mount |
| Temperatura de funcionamiento | 0°C to 105°C | [DATA_NEEDED: operating temperature grade] |
| Nivel MSL | 3 | — |
| Peak Reflow Temperature | 245°C (JEDEC J-STD-020) | — |
| Terminal Finish | Tin Silver Copper (e1, JESD-609) | — |
| TDM Links | Up to 4 independent, 62.5 Mbps each | — |
| Estado RoHS | Compliant | Compliant |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Core Revision | — | StarCore R2.1 |
| Maximum Core Clock | — | 1 GHz |
| MIPS | — | [DATA_NEEDED: MIPS rating for 1 GHz SC3850] |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| L2 Unified Cache | — | 512 KB (configurable, SRAM or MAP) |
| On-Chip RAM | — | 576 KB |
| Internal ROM | — | 96 KB |
| TDM Interfaces | — | 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support |
| Ethernet MAC | — | Yes (integrated) |
| DMA Controller | — | Multi-channel DMA |
| Package Type | — | FCBGA (Flip-Chip Ball Grid Array) |
| Package Pin Count | — | 783 balls |
| Package Dimensions | — | 29 mm x 29 mm |
| Lead-Free / Halogen-Free | — | Yes (lead-free, halogen-free package) |