MT40A512M16TB-062E:R vs H5AN8G6NDJR Comparison

Detailed side-by-side comparison of MT40A512M16TB-062E:R by Micron Technology and H5AN8G6NDJR by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Micron Technology
MT40A512M16TB-062E:R MT40A512M16TB-062E:R - 8Gb DDR4 SDRAM 3200MT/s | Micron

MT40A512M16TB-062E:R - 8Gb DDR4 SDRAM 3200MT/s | Micron

MT40A512M16TB-062E:R ✓ Active
SK hynix
H5AN8G6NDJR H5AN8G6NDJR - 8Gb DDR4-3200 SDRAM | SK hynix

H5AN8G6NDJR - 8Gb DDR4-3200 SDRAM | SK hynix

H5AN8G6NDJR ✓ Active

Specification Comparison

Parameter MT40A512M16TB-062E:R H5AN8G6NDJR
Brand Micron Technology SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $60.00 $35.00
Memory Type DDR4 SDRAM DDR4 SDRAM
Memory Size 8 Gbit (512M x 16) —
Data Rate 3200 MT/s 3200 Mbps (DDR4-3200)
Clock Frequency 1600 MHz —
CAS Latency 22 22 cycles (at 3200 Mbps)
Supply Voltage (VDD/VDDQ) 1.2V ±60mV —
VPP Voltage 2.5V (-125mV, +250mV) —
Operating Temperature 0°C to +95°C —
Package 96-FBGA (7.5x13 mm) 96-ball FBGA (13mm x 7.5mm)
Interface Parallel —
Data Bus Width 16 bits —
Refresh Time 8192 cycles (64ms at -40°C to 85°C, 32ms at >85°C to 95°C, 16ms at >95°C) —
I/O Type 1.2V pseudo open-drain —
Features Auto self-refresh, auto precharge, write leveling, CRC, dynamic on-chip termination, ZQ calibration Auto self-refresh, auto precharge, asynchronous reset, data mask, dynamic ODT, ZQ calibration, CRC, write leveling
RoHS Status Compliant —
Density — 8 Gb
Organization — 512M x 16
Supply Voltage — 1.2 V
Number of Terminals — 96
Maximum Supply Voltage (Vsup) — 1.26 V
Maximum Operating Temperature — 85 °C
Burst Length — 8 (BL8), 4 (BC4)
Access Mode — Multi Bank Page Burst
JESD-30 Code — R-PBGA-B96
RoHS — Compliant

Datasheets & Resources

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