MT40A512M16TB-062E:R - 8Gb DDR4 SDRAM 3200MT/s | Micron
MPN: MT40A512M16TB-062E:R ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $76.57 | $76.57 |
| 10 | $72.5 | $725.00 |
| 100 | $68 | $6,800.00 |
| 500 | $64 | $32,000.00 |
| 1,000 | $60 | $60,000.00 |
Drop-in alternatives for MT40A512M16TB-062E:R — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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✅ Drop-In✓ 99,999 In Stock
$7.5 / Unit
View Datasheet →MT40A512M16TB-062E:R Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Memory Size | 8 Gbit (512M x 16) |
| Data Rate | 3200 MT/s |
| Clock Frequency | 1600 MHz |
| CAS Latency | 22 |
| Supply Voltage (VDD/VDDQ) | 1.2V ±60mV |
| VPP Voltage | 2.5V (-125mV, +250mV) |
| Operating Temperature | 0°C to +95°C |
| Package | 96-FBGA (7.5x13 mm) |
| Interface | Parallel |
| Data Bus Width | 16 bits |
| Refresh Time | 8192 cycles (64ms at -40°C to 85°C, 32ms at >85°C to 95°C, 16ms at >95°C) |
| I/O Type | 1.2V pseudo open-drain |
| Features | Auto self-refresh, auto precharge, write leveling, CRC, dynamic on-chip termination, ZQ calibration |
| RoHS Status | Compliant |
MT40A512M16TB-062E:R Pin Configuration
| Pin A1 | VDD — Power supply |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin A4 | VSS — Ground |
| Pin A5 | DQ2 — Data input/output 2 |
| Pin A6 | DQ3 — Data input/output 3 |
| Pin A7 | VDDQ — I/O power supply |
| Pin A8 | DQ4 — Data input/output 4 |
| Pin A9 | DQ5 — Data input/output 5 |
| Pin A10 | VSS — Ground |
| Pin A11 | DQ6 — Data input/output 6 |
| Pin A12 | DQ7 — Data input/output 7 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
MT40A512M16TB-062E:R is suitable for 6 applications: Server Memory, Networking Equipment, Industrial Computing, High-Performance Embedded Systems, Data Center Storage, Telecommunications Infrastructure.
Server Memory
The MT40A512M16TB-062E:R is ideal for server memory modules (DIMMs) where high density and high data rates are critical. With 8Gb capacity and 3200 MT/s data rate, it supports demanding server workloads such as virtualization, cloud computing, and big data analytics. The low 1.2V supply voltage reduces power consumption, which is essential in data centers. Its 96-ball FBGA package allows for compact module designs, and the on-die termination and CRC features enhance signal integrity in multi-rank configurations.
Recommended
Networking Equipment
In networking equipment such as routers, switches, and firewalls, the MT40A512M16TB-062E:R provides high-speed packet buffering and forwarding. The 3200 MT/s data rate ensures low latency for data processing, while the 8Gb capacity supports large routing tables and connection tracking. The device's auto self-refresh and write leveling features help maintain data integrity in high-throughput environments. Its commercial temperature range (0°C to +95°C) is suitable for indoor networking gear, and the compact FBGA package fits in space-constrained line cards.
Recommended
Industrial Computing
The MT40A512M16TB-062E:R is well-suited for industrial PCs, embedded controllers, and edge computing devices that require reliable memory in harsh environments. With a commercial temperature range of 0°C to +95°C, it can operate in many industrial settings. The high data rate and low power consumption make it efficient for real-time data processing and control applications. The device's robust features, including CRC and dynamic on-chip termination, ensure reliable operation in electrically noisy industrial environments. Its 96-ball FBGA package is compatible with standard SMT assembly processes.
Recommended
High-Performance Embedded Systems
For high-performance embedded systems such as advanced driver-assistance systems (ADAS), medical imaging, and military/aerospace computing, the MT40A512M16TB-062E:R offers the speed and capacity needed for complex algorithms. The 3200 MT/s data rate enables fast data throughput, while the 8Gb capacity supports large datasets. The device's low power consumption is beneficial for battery-powered or thermally constrained systems. Although the standard version is commercial temperature, the AIT variant is available for automotive applications. The FBGA package provides a small footprint for compact embedded boards.
Recommended
Data Center Storage
In data center storage systems, the MT40A512M16TB-062E:R is used in storage controllers and SSDs for caching and metadata management. The high data rate and low latency are essential for fast I/O operations. The 8Gb capacity allows for large cache pools, improving read/write performance. The device's low power consumption helps reduce overall data center energy costs. Its commercial temperature range is suitable for controlled data center environments, and the FBGA package enables high-density memory arrays on controller boards.
Recommended
Telecommunications Infrastructure
The MT40A512M16TB-062E:R is used in telecommunications infrastructure such as base stations, switches, and signal processing units. The high data rate supports high-bandwidth communication protocols, while the 8Gb capacity handles large buffers for voice, video, and data traffic. The device's features like write leveling and dynamic on-chip termination ensure signal integrity in high-speed digital designs. Its commercial temperature range is appropriate for indoor telecom equipment, and the compact FBGA package is ideal for dense line cards and processing modules.
Recommended
Recommended Products Summary
Engineering reference data for MT40A512M16TB-062E:R — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MT40A512M16TB-062E AIT:R | MT40A512M16TB-062E IT:R | MT40A512M16TD-062E:R | AS4C512M16D4B-62BCN |
|---|---|---|---|---|---|
| Package | 96-FBGA (7.5x13 mm) | 96-FBGA (7.5x13 mm) | 96-FBGA (7.5x13 mm) | 96-FBGA (7.5x13 mm) | 96-FBGA (7.5x13 mm) |
| Brand | Micron Technology | Micron Technology | Micron Technology | Alliance Memory | Alliance Memory |
| Memory Size | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit |
| Data Rate | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s |
| Operating Temperature | 0°C to +95°C | -40°C to +125°C | -40°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| Supply Voltage | 1.2V | 1.2V | 1.2V | 1.2V | 1.2V |
| CAS Latency | 22 | 22 | 22 | 22 | 22 |
| Automotive Grade | No | Yes | No | No | No |
Key Differentiators
- High data rate of 3200 MT/s (vs MT41K256M16HA-125:E)
- 8Gb density in a 96-ball FBGA (vs K4B4G1646D-BYK0)
- Automotive variant available (vs AS4C512M16D4B-62BCN)
Design Notes
For DDR4-3200 operation, follow Micron's layout guidelines: ensure trace length matching for DQ, DQS, and address/command signals. Use fly-by topology for address/command and control signals to reduce signal integrity issues. Maintain 50-ohm single-ended impedance and 100-ohm differential impedance for DQS pairs. Keep the memory controller and DRAM as close as possible to minimize trace lengths.
Decouple VDD and VDDQ with 0.1uF and 1uF ceramic capacitors placed close to each power pin. Use a solid power plane for VDD and VDDQ to minimize impedance. The VPP supply (2.5V) should be decoupled with a 1uF capacitor. Ensure the power supply can handle the peak current during refresh and active operations.
The MT40A512M16TB-062E:R operates up to +95°C. Ensure adequate airflow or heatsinking in high-temperature environments. The FBGA package has a thermal resistance that should be considered; refer to the datasheet for theta_JA values. For high-density modules, consider thermal simulation to ensure junction temperature stays within limits.
Compliance Information
RoHS compliant per distributor listings. Not AEC-Q100 qualified; automotive variant available.
