MT41K128M16JT-125 AUT:K vs K4B4G1646E-BYK000 Comparison

Detailed side-by-side comparison of MT41K128M16JT-125 AUT:K by Micron Technology and K4B4G1646E-BYK000 by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Micron Technology
MT41K128M16JT-125 AUT:K MT41K128M16JT-125 AUT:K - 2Gbit DDR3L SDRAM 96-FBGA | Micron

MT41K128M16JT-125 AUT:K - 2Gbit DDR3L SDRAM 96-FBGA | Micron

MT41K128M16JT-125 AUT:K ✓ Active
Samsung Electronics
K4B4G1646E-BYK000 K4B4G1646E-BYK000 - 4Gb DDR3L SDRAM 256Mx16 | Samsung

K4B4G1646E-BYK000 - 4Gb DDR3L SDRAM 256Mx16 | Samsung

K4B4G1646E-BYK000 ✓ Active

Specification Comparison

Parameter MT41K128M16JT-125 AUT:K K4B4G1646E-BYK000
Brand Micron Technology Samsung Electronics
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $12.17 $0.56
Memory Type DDR3L SDRAM DDR3L SDRAM
Memory Size 2 Gbit 4 Gbit
Organization 128M x 16 256M x 16
Clock Frequency 800 MHz 800 MHz
Access Time 13.75 ns 1.25 ns
Supply Voltage 1.35 V —
Interface Parallel Parallel
Speed Grade -125 (1600 MT/s) DDR3-1600 (1.25 ns clock cycle)
Package 96-FBGA (8x14) 96-FBGA (BYK)
Operating Temperature -40C to +125C [DATA_NEEDED: operating temperature range]
Automotive Qualification Yes (AUT part number suffix) —
Mounting Type Surface Mount Surface Mount
Marking Code D9VKD —
Data Rate 1600 MT/s —
Packaging Option Tape & Reel (TR suffix variant available) —
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
CAS Latency (CL) — [DATA_NEEDED: CAS latency - 1.25 ns CL grade indicates CL11 but not explicitly stated in provided data]
Supply Voltage (VDD) — 1.35 V (DDR3L), 1.5 V compatible (DDR3)
Number of Banks — [DATA_NEEDED: bank count]
Die Process — Samsung E-die
Features — Auto precharge, asynchronous reset, ZQ calibration, dynamic on-chip termination, data mask

Datasheets & Resources

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